PCB / Printed Circuit Board 2layer

Prod Model:	CTE-069
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Type:	Rigid Circuit Board
Dielectric:	FR-4
Material:	Fiberglass Epoxy
Flame Retardant Properties:	V0

Shenzhen Chi Tun Electronics Co., Ltd. is an experienced professional supplier of printed circuits, focused in providing the solution for an extensive range of boards with the highest industry standards of quality at the most competitive prices and time efficiency to our valued customers in computer, telecommunication, consumer electronics, automotive, Industrial control, aerospace, medical, military and other electronic assembly industries.

Chi Tun is able to meet different requirements of technology and customer's needs. Whether it is high density single sided, double sided or multi-layer boards up to 30layer. We can make it happen, we can serve your needs in all PCB areas, including rigid, flex and rigid-flex circuits, and HDI boards, And whether you need quick-turn, prototype, short-run or high volume production, we can handle your toughest requirements with ease.

Chi Tun services will allow you to be the most competitive player in your market, by upholding your quality, and bringing you the edge in terms of pricing, access to dedicated & specialized production facilities in the cost-competitive country, and improvement of your suppling capability.

Chi Tun believe that in order to be successful we must be an "extension of our customer, " To be part of the team and take ownership in the time-to-market challenges our customer faces. To develop the products, make them efficient and cost effective through manufacturing, and most of all, the most reliable in the field. We should appreciate the opportunity of showing you how efficiently and cost effective we can supply your needs.

TECHNOLOGY:

. RoHS/ Lead Free

. HDI Microvias

. Blind Vias

. Buried Vias

. Selective Plating

. Impedance Control

Manufacturing Standard:

. IPC-A-600G Class II

. IPC-A-600G Class III

. PERFAG 2E for Double-Sided Board

. PERFAG 3C for Multilayer Board

Capability

Min. Finished Holes Size: 0.008" (0.20mm)

Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)

Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)

Maximum copper thickness: 5oz (140um)

Thin board thickness:

. DS - 0.008 inches (0.20mm)

. 4/L - 0.016 (0.40mm)

. 6/L - 0.020 inches (0.60mm)

Maximum board thickness:

. 275.8mil (7.0mm)

Surface treatment:

. HASL/lead free HAL/gold plating

. Immersion gold

. Immersion tin

. Immersion silver

. Gold fingers (hard gold)

. OSP

Other:

. Account of layers: Double-side to above 20 layers (1 to 30 layers)

. Max PCB dimensions: 23 X 35 inches (584.2 X 889.0mm)

. Solder mask bridge between solder dam: 4mil (0.10mm)

. Minimum solder mask annular: 1.5mil (0.038mm)

. Min thickness of solder mask: 0.40mil (10um)

. Solder mask colors: Green, yellow, black, blue, matte, transparence LPI solder mask and peelable solder mask

. Min height of Legend: 4mil (0.10mm)

. Min width of front: 25mil (0.635mm)

. Legend colors: White, yellow, black

Data format: GERBER, PROTEL, PADS2000, Powerpcb, ODB++

Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating

Other test: Impendence control, resistor of hole test, micro section, ionic cleanliness test, Soldering capacity, thermal shocking, reliability test, etc.