Categories
| Price: | US $ 0.01-50/Piece |
|---|---|
| Trade Terms: | FOB,CFR,CIF |
| Min Order: | 1/Piece |
| Pay Type: | L/C,T/T,D/P,Paypal,Money Gram |
| Factory Manufacture Capability | ||
| NO | ITEM | Techinical capabilities |
| 1 | Materials | CEM-1 CEM-3 FR-4 High-TG Teflon Rogers etc. |
| 2 | layers | 1-16 layers |
| 3 |
Min. core material |
5mil(excluding copper) |
| 4 | Prepreg type | 7628 2116 1080 3313 |
| 5 | Max. board size | 520*720mm |
| 6 | Copper thickness | min. base copper 1/3 OZ |
| max. finished copper6OZ | ||
| 7 | Min. board thickness | 2- layer 10mil |
| 4- layer 16mil | ||
| 6-layer 24mil | ||
| 8-layer 32mil | ||
| 10-layer 40mil | ||
| 8 | Max. board thickness | 236mil(finished board thickness) |
| 9 | Min. line width/space | 3mil/3mil HOZ copper base(inner layer) |
| 10 | Min. hole size | 8mil |
| 11 | PTH wall thickness | ≥ 1mil |
| 12 | Hole dia. tolerance | ± 3mil |
| 13 | Hole dia. tolerance | ± 2mil |
| 14 | Countersink hole | Min. depth(D)6mil; The Depth of tolerance± 6mil |
| 15 | Drilling hole positional deviation(outer layer) | 1st-drill ± 3mil(Normal) ± 2mil(min. ) |
| 2nd-drill ± 4mil | ||
| 16 | Min. solder mask bridge | 3.2mil(HOZ base copper, green) |
| 17 | Outline tolerance | ± 4mil |
| 18 | Twist & Bow | ≤ 0.75% |
| 19 | Peelable mask thickness | ≥ 8mil 1 printing |
| 20 | Insulation Resistance | > 1012Ω Normal |
| 21 |
Through hole resistance |
< 300Ω Normal |
| 22 | Current breakdown | 10A |
| 23 | Peel strength | 1.4N/mm |
| 24 | S/M abrasion | > 6H |
| 25 | Thermal stress | 28 degrees 20Sec |
| 26 | Test Voltage | 20-300V |
| 27 | Min. blind/burried via | 8mil |
| 28 | Surface finish | HAL ENIG IMAG IMSN OSP HAL+G/F ENIG+G/F |
| 29 | Impedance control | Single ended impedance 50Ω /70Ω ± 10% Normal |
| Differential impedance 90Ω /100Ω ± 10% Normal | ||
| 30 | Max. aspect ratio | 12: 1 |
| Prod Model: | XML-04 |
|---|---|
| Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Export Markets: | Global |
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
| Material: | Fiberglass Epoxy Resin + Polyimide Resin |
| Flame Retardant Properties: | HB |
