Heat-resistance Epoxy potting adhesives and sealants/conductive epoxy adhesive
E4209A/B is two-component excellent adhesion and Heat-resistance Solvent-free Room Temperature Curable Epoxy Potting Sealant.
Features
1. Good toughness, high hardness
2. Excellent adhesion, resistance to cracking
3. Excellent electrical insulation properties, stability
4. High thermal conductivity, low thermal expansion coefficient
5. Higher Tg, can be used in the -60 ° C -200° C long-term
6. Good waterproof, moisture resistance, low water absorption
Use
It is suitable for high thermal conductivity packaging protection product requirements in automotive electronics.
Operation
1. Mixing: Stirring A component evenly in the original package, then A, B components according to the weight ratio of 4: 1 are weighed and mixed.
2. Using it after stirring evenly and vacuum defoamation, finished within 60 mins.
3. If necessary, the device with good sealing can continue to vacuumize, is helpful to increase the electrical properties of the device.
4. The curing conditions: 80 ° C/2hrs or 25 ° C/24hrs.
5. For the use of glue equipment please consult our marketing department.
Package & Storage
Package Storage
A component: 4kg/ bucket (plastic bucket) Seal and Avoid light and light
B component: 1kg/ bottle Temperature≤ 25° C, humidity≤ 50%RH
Shelf life: Part A 12months, Part B 6 months
|
Properties before curing |
|
|
E4209A |
E4209B |
|
Appearance |
Little yellow liquid |
Brown liquid |
|
Viscosity, mPa.s(25° C) |
10,000-15,000 |
50-100 |
|
Density, g/cm3(25° C) |
1.10±0.05 |
1.05±0.05 |
|
Mixture/mass ratio, weight |
100 : 25 |
|
Viscosity after mixing, mPa.s (25° C) |
4000±500 |
|
Operation time 25° C,hr |
1 |
|
Gel time 25° C,hr |
5 |
|
Properties after curing |
|
Hardness, Shore D |
≥90 |
|
Thermal conductivity, W/mK |
0.27 |
|
Expansion coefficient, μm/(m,° C) |
210 |
|
Glass transition temperature , ° C |
155 |
|
Tensile-shear strength Mpa, Fe / Fe |
≥10 |
|
Dielectric strength, KV/mm,25° C |
≥20 |
|
Loss factor(1 MHz)(25° C) |
0.09 |
|
Dielectric constant (1 MHz)(25° C) |
2.9 |
|
Volume resistance DC500V, Ω@cm |
1.2×1015 |
2.00E +15 |
Founded in DEC. 2003, SEPUNA has been engaged in researching, manufacturing and marketing automobile sealant and adhesive for 9 years.
Since the foundation, SEPUNA Chemical has been focusing on adhesive's researching and application. Then in 2005, We acquired PUNADE technology which is from Switzerland.
Within 9 years, SEPUNA mainly develops Silicone, Polyurethane and Epoxy resin adhesives. And in the future, we will enlarge our line to Unsaturated, Natural and Acrylic Resin adhesive.
After 9 years' improvement, by the keep researching and innovation, SEPUNA is already a mature adhesive supplier with the core competitiveness.
