Feature:
1. Small size chips generating high impendance
2. Excellent solderalbility and high heat resistance for either flow or reflow soldering
3. Monolithic structure for high reliability
4. Low DC resistance structure of electrode prevents wasteful electronic pow consumption
Description:
| Shape | L | W | T |
| 201 | 0.6+-0.03 | 0.3+-0.03 | 0.3+-0.03 |
| 402 | 1+-0.05 | 0.5+-0.05 | 0.5+-0.05 |
| 603 | 1.6+-0.15 | 0.8+-0.15 | 0.8+-0.15 |
| 805 | 2.0+-0.2 | 1.25+-0.2 | 0.9+0.15/-0.2 |
| 1206 | 3.2+-0.2 | 1.6+-0.2 | 1.1+-0.2 |
| 1206H | 3.2+-0.2 | 1.6+-0.2 | 1.6+-0.2 |
| 1210 | 3.2+-0.2 | 2.5+-0.2 | 1.3+-0.2 |
| 1806 | 4.5+-0.2 | 1.6+-0.2 | 1.6+-0.2 |
| 1812 | 4.5+-0.2 | 3.2+-0.2 | 1.5+-0.2 |
We guaranteed products at a competitive price and high quality. At present, our products have a very good sale in domestic and overseas market. We wish to cooperate with you to create a bright future and mutual benefit. Much appreciation for your prompt attention in advance, we are eager to look forward to hearing from you soon.
