Product Specifications
| Prod Model: |
ES-500 |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| State: |
Solid |
| Type: |
Resin |
| PH: |
Acidic |
Product Description
1, the soldering effect is very good.
2, don't corrosive to IC and PCB.
3, the boiling point is only a slightly higher than the melting point of soldering tin
Igh lead,
High melting point alloys, lead content is more than 85%. Can meet the RoHS directive. Usually used in package of power semiconductor device, can Miscibility with Au, Cu, AG, high residual impedance and good welding strength.
When soldering solder tin melted soon, it began boiling, absorption of heat and vaporization, can keep the IC and PCB at this temperature. When dismantle the chip, the solder paste use more. It can quickly melt and flow to the below of BGA chips.
This is flux, if you buy it send by express, the safety check in can not pass it, so this flux can not send by express, please note, thanks.
Weigh 100g
Shenzhen Earlysun technology Co., Ltd., founded in 2004 in shenzhen nanshan district, a registered capital of 10 million yuan, Earlysun is an innovative new materials technology and product development company, committed to cost-effective and environmentally friendly LED encapsulation materials, solder paste packaging materials, adhesive colloid encapsulation materials and other fine chemical materials development and production, is China's power semiconductor and integrated semiconductor packaging solder national innovative enterprise leader and LED packaging materials.
