High Tensile Epoxy Adhesive for Transformer (SE2211)
SE2211 is epoxy adhesive with high tensile and high curing speed
Features
1. Resistance of moisture, pollution and other atmospheric constituent
2. High tensile, excellent adhesive property
3. Excellent pollution resistance, the demand of preprocess is low
4. No solvent, no curing by-products
5. Wonderful anti-temperature (-50~150º C )
6. Excellent adhesive performance with fiberglass and metal sheet
7. Have passed the UL certification
Use
For SMC FRP bonding, aluminum honeycomb pane splicing, transformer motor core bonding, Nomex paper bonding etc.
Operation
1. Buckets of A and B material is recommended to be stirred before using the components of A/B, A, B should be paid attention to seal preservation after using.
2. Stirring should pay attention to the same direction, otherwise there will be mixed with too many air bubbles; Container frame and bottom of the rubber should also stir evenly, otherwise there will be a local not curing phenomenon caused by the mixing inequality
3. The temperature is too low will cause the curing speed slow, when unable to reach initial strength, constant temperature control required on site.
4. Cartridge packaging use midway need to keep the material mouth sealed.
5. This curing process of adhesive is exothermic reaction, the adhesive quantity will affect the duration of operation, thus the operating time with 100 g adhesive is only a reference time.
Package Storage
Part A: 20kg/bucket, 310ml/cartridge Seal and Avoid light and light
Part B: 20kg/bucket or 310ml/cartridge Temperature≤ 25º C, humidity≤ 50%RH
Customized packaging Shelf life: Part A 12months, Part B 12 months
|
Properties before curing |
|
Part |
A |
B |
|
Appearance |
Black thick paste |
Off-white thick paste |
|
Density, g/cm3(25 ºC ) |
1.35 |
1.35 |
|
Mixture/mass ratio, weight |
100:100 |
|
Mixture/mass ratio, volume |
100:100 |
|
Viscosity after mixing,mPa.s (25 ºC ) |
Thixotropy |
|
Density after mixing, g/cm3(25 ºC ) |
1.35 |
|
Operation time after mixing, min(25 ºC ) |
10 |
|
Preliminary curing time, ºC /min |
60/20 or 25/70 |
|
Properties after curing |
|
Hardness, Shore D |
90 |
|
Tensile-shear strength Mpa ,Al/Al |
17 |
|
Heat conductivity, W/mK |
0.4 |
|
Expansion parameterμm/(m, ºC ) |
44 |
|
Water absorption 24h,25 ºC ,% |
<0.3 |
|
Dielectric strength, KV/mm,25 ºC |
>20 |
|
Loss factor(1 MHz) |
0.014 |
|
Dielectric constant (1 MHz) |
3.53 |
|
Volume resistance DC500V, Ω@cm |
1.2×10 15 |
Founded in DEC. 2003, SEPUNA has been engaged in researching, manufacturing and marketing automobile sealant and adhesive for 9 years.
Since the foundation, SEPUNA Chemical has been focusing on adhesive's researching and application. Then in 2005, We acquired PUNADE technology which is from Switzerland.
Within 9 years, SEPUNA mainly develops Silicone, Polyurethane and Epoxy resin adhesives. And in the future, we will enlarge our line to Unsaturated, Natural and Acrylic Resin adhesive.
After 9 years' improvement, by the keep researching and innovation, SEPUNA is already a mature adhesive supplier with the core competitiveness.
