Product Specifications
| Prod Model: |
AG72CU28 |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
Product Description
AG72Cu28 alloy solder preform is a typical high temperature solder which is usually allpicated in metal/cermetic/glass soldering. Soldering temperatures are from 779 degrees. It has good soldering strength and good wettablity. Bolinmaterial can produce any solder preforms shape based on customer's requirements.
Bolin Electronic Package Material Co., Ltd. is a hi-tech company expertizing on the development and manufacture of alloy solder preform, foil and wire that using in electronic packaging and assembly. We mainly focus on new package material searching and developing and high precise producing. Our products are widely applicated for welding of hi-power LED, optical chips, hermetic package, solar panel and optical communication devices.
In Bolin material there are excellent human resource and well facilities for product development, pilot and high volume manufacture. One department was created especially for die high-precise design and manufacture, it helps us meet customers' most requirements on shape and dimension and ensure our manufacturing precision and production speed. We set comprehensive and strict control to every key process, parameter. Sampling test every batch material from front line to end line. Every batch material has its own traceability during whole supply chain. All these we have done are for shipping high-quality and consistent products to you.
Our engineers have comprehensive knowledge in soldering of electronic packaging and assembly. They are ready to provide professional technical supporting to you. Welcome to contact us.
Our Purpose:
Serve you with Innovation, sincerity and good service.
