SMT PCB Solder paste wire
Product details :
1.low/middle/high temperature available
2.high insulation
3.good quality and competitive price
4.fast delivery
Product features:
1. Excellent stability,resolving power for continuous printing; good viscosity
2. Without causing slumping, bridging or splashing of tin ball
3.Alloy components :Sn96.5/Ag3/Cu0.5
model | lead free solder paste type | alloy | metal point (°C) |
MD-P001 | low temperature | Sn42/Bi58 | 180 |
middle temperature | Sn64/Bi35/AG1 | 200 |
high temperature | Sn96.5/AG3/CU 0.5 | 217 |
Large order , biggest discount
Specifications:
Apply to fine spacing solder paste printing and back to welding, suitable for welding, high nitrogen back preheated back welding, gold-plated,
Silver, nickel plating, spray tin, nude copper printed circuit board and so on many kinds