BGA rework station welding machine 3 heat area
1. It is ideal for PS3 and xBox 360 game console which with larger mainboards and thicker, bigger size BGA chips.
2. It is can be widely used in computer, cell phones, industrial computer, switches, graphics cards, shielding enclosures, CPU's seat, components slot and other large circuit boards with large chips up to 65X65mm repair.
3. It can repair CBGA, CCGA, CSP, QFN, MLF, PGA μBGA For CBGA, CCGA, CSP, QFN, MLF, PGA and all green epoxy and other chip-level μBGAs efficiently &easily.
4. And for small resistors, capacitors and so on, the soldering iron is ideal for selection. You do not need to pay extra money for another soldering iron.
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Scotle IR360 general features |
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Packing |
Wooden box |
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Out packing demensions |
64X62X62mm |
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Net Weight |
26KG |
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Temperature Control |
High-precision K type
Thermocouple
closed-loop control |
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PCB Positioning |
V-groove, PCB support can be adjusted in X,Y direction |
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PCB Size |
Min:20x20mm
Max:320mmx375mm |
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Application |
BGA,PBGA,CBGA,
CFP,CPU,CSP in leaded&lead free |
This is an honest supplier from China, will give a best quotation, anything that I can help welcome to enquiry. Glad to provide the service. Business cover the lemo connector and BGA rework soldering and resoldering station, earphone OEM service.
