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Immerison Gold Circuit Board with Contract Manufacturing

Price:	US $ 0.1-50/Piece
Trade Terms:	FOB,CIF,DAP
Min Order:	1/Piece
Pay Type:	L/C,T/T,Paypal,Western Union

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Showroom Product Company Profile

Immerison Gold circuit board with contract manufacturing

Layer: 4 layer,
Material: FR-4, 1.6mm+/-10%
Copper: 2/2 oz finish
Surface finish: Immersion Gold
Solder-mask: Green
Leagend: white
Surface finish : Immersion Tin/Sn (White Sn)
Min. Via hole size: dia. 20 mil
Board size: 450mm x 460mm
Profile: CNC routing
Q'TY: prototype, middle volume, mass production
E-test: 100% Fixture
Package: vacuum package
Quality report: Solderability test, E-test report, Final inspection,
Certification: RoHS compliant, Lead free, ISO 9001, UL,TS16949

Factory Manufacture Capability
NO	ITEM	Techinical capabilities
1	Materials	CEM-1 CEM-3 FR-4 High-TG Teflon Rogers etc.
2	layers	1-16 layers
3	Min. core material	5mil(excluding copper)
4	Prepreg type	7628 2116 1080 3313
5	Max. board size	520*720mm
6	Copper thickness	min. base copper 1/3 OZ
6	Copper thickness	max. finished copper6OZ
7	Min. board thickness	2- layer 10mil
		4- layer 16mil
		6-layer 24mil
		8-layer 32mil
		10-layer 40mil
8	Max. board thickness	236mil(finished board thickness)
9	Min. line width/space	3mil/3mil HOZ copper base(inner layer)
10	Min. hole size	8mil
11	PTH wall thickness	≥ 1mil
12	Hole dia. tolerance	± 3mil
13	Hole dia. tolerance	± 2mil
14	Countersink hole	Min. depth(D)6mil; The Depth of tolerance± 6mil
15	Drilling hole positional deviation(outer layer)	1st-drill ± 3mil(Normal) ± 2mil(min. )
15	Drilling hole positional deviation(outer layer)	2nd-drill ± 4mil
16	Min. solder mask bridge	3.2mil(HOZ base copper, green)
17	Outline tolerance	± 4mil
18	Twist & Bow	≤ 0.75%
19	Peelable mask thickness	≥ 8mil 1 printing
20	Insulation Resistance	> 1012Ω Normal
21	Through hole resistance	< 300Ω Normal
22	Current breakdown	10A
23	Peel strength	1.4N/mm
24	S/M abrasion	> 6H
25	Thermal stress	28 degrees 20Sec
26	Test Voltage	20-300V
27	Min. blind/burried via	8mil
28	Surface finish	HAL ENIG IMAG IMSN OSP HAL+G/F ENIG+G/F
29	Impedance control	Single ended impedance 50Ω /70Ω ± 10% Normal
29	Impedance control	Differential impedance 90Ω /100Ω ± 10% Normal
30	Max. aspect ratio	12: 1

Prod Model:	XML4MZ01
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Color:	Green, Blue, Black, Yellow, Red, White
Package:	Custom Pack
Type:	Rigid Circuit Board
Dielectric:	FR-4
Material:	Fiberglass Epoxy
Flame Retardant Properties:	V0
Model:	Xml6mz04
Brand:	Xml

Shenzhen X-Mulong Circuit Co., Ltd. is a professional Manufacturer of Printed Circuit Boards. Established in 2007, the company sticks to make the best printed circuit boards with high quality, high precision and multi-species. There are two factories, totally 6500 square maters. We can supply up to 16-layer PCB.

Nowadays we supply a monthly capacity of 12, 000 sq. m for samples and small to middle-sized volumes, but our production capacity can reach 15, 000 sqm/1500 part numbers per month. We continuously invest big capital in purchasing advanced equipments. Meanwhile, in order to ensure the production process stability and excellent quality, we introduce all-round monitoring and mature quality management system. As we always stick to the principle of "quality first, credit upmost, continuous improvement and customer satisfaction", we serve customers thoughout the world with excellent quality and competitive price. Our customers are mainly from Europe, America and Asia.

So, discover ShenZhen X-Mulong Circuit. You'll find us to be a market-focused enterprise that has the proven processes and dedicated people to deliver printed circuit boards at the Price, Quality and Timing you want.