100g RoHS tin Bi solder paste of No Clean item with syringe packing
Sn64Bi35AG1 lead free solder paste is a MID processing temperatures required for lead-free soldering make unprecedented demands on solder pastes. In addition to consistent printing and reflow requirements, there is a need for MID repeatability in MID mix, MID-yield lines. All these and other Pb-free challenges are met with consistency in SMT SolderPaste. Com's lead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life.
Feature of solder paste
Sn64Bi35AG1 solder paste is an Sn64%/Bi35%/AG1% tin alloy with Type 3 particle size (+45 µ M 1% less, -20 µ M 10% less) and no-clean ROL1 flux. It comes packaged in a 500-gram jar.
Pb < 1000 ppm, CD < 20 ppm
High print speed: 0-120 mm/sec
Over 8 hours stencil life
Extended tack time > 12 hours
Excellent wettability
Low void
Basic informations of Solder Paste
1. Solder paste is a sticky grey substance that is somewhat liquid - well that's a paste now isn't it...Pretty much lead and tin mixed together with flux and some other magic ingredients.
2. It's a No-Clean paste which means after you are done reflowing the board, you're done! No need to wash the board. Any solder paste will do.
Payment:
*We accept 100%T/T in advanced under $10, 000;
*Western Union: Under $1000
*30%deposite, 70%balance before delivery for mass qty cargos.
*Paypal and L/C can be discuss
Chemistry component |
Sn |
Ag |
Cu |
Pb |
Sb |
Bi |
Zn |
Fe |
Al |
As |
Cd |
| 63 | <0.02 | <0.05 | 37+/-1 |
<0.02 |
<0.01 |
<0.003 |
<0.02 |
<0.001 |
<0.03 |
<0.002 |
Specification --
Item |
Specification |
Standard |
Appearance |
Gray paste w/o visible foreign matter and clusters |
|
Alloy composition |
Sn64Bi35Ag1 |
JIS-Z-3282 |
Melting Point |
217-219 °C |
|
Particle Size |
(Type 3) +45μm < 1%, _20μm < 10%
(Type 4) +38μm < 1%, _20μm < 10%
(Type 5) +25μm < 1%, _15μm < 10% |
IPC-TM-650,2.2.14 |
Powder Shape |
Spherical |
|
Flux Content |
12 ± 0.7wt% |
JIS-Z-3197, 8.1.2 |
Viscosity |
200 ± 50 Pa s (25±1 C°, 10rpm,Malcom ) |
JIS-Z-3284, Annex 6 |
Flux Type |
ROL1 |
J-STD-004A |
BBIEN is a professional enterprise in the development, manufacturing and sales of innovative materials used in the electronic assembly process. BBIEN is a full line supplier of reflowing Solder Paste, Cored Wire and bar Solder, metal powder, non-ferrous metal alloy wire, lanthanon permanent magnet, BGA Soldering Fluxes, SMD Adhesives, and some chemical materials soldering. BBIEN'S metal solders and alloy products could meet and up to international and domestic standard.
More than 10 years specialized in metal industry, BBIEN accumulated a lot of talent and technology, created international marketing network, for now, BBIEN have cooperated with many of oversea enterprises of over 100 countries around the world.
As the industry demands higher performance and more rapid technology implementatio, BBIEN HIGH TECHNOLOGY INDUSTRY sees the answers coming from its intimate knowledge of materials and processes. We are uniquely qualified to provide you with the total process solutions you are looking for. We accomplish this by applying innovative thinking, creative.
