Mainly used for electronics assemblies like SMT, SMD, BGA and IC packing
Features:
Good viscosity stability, suitable for high speed printing
Good wetting ability, suitable for nickel, palladium
Bright soldering joints, checked by probe after soldering.
There have three used way for Solder paste: Template printing, dispensing, pin transfer. In the three methods, the dispensing's automation and precision is the highest. It require high thixotropy and uniformity for this kind of solder paste. It need to achieve consistent dispensing in the entire operation course, and it need higher requirement for the viscosity and chemical stability of this solder paste.
The packaging usually is 100g/30CC and 35g/10CC. 500g/bottle The specific characteristics of each alloy and its application can reference the Products.
Shenzhen Earlysun technology Co., Ltd., founded in 2004 in shenzhen nanshan district, a registered capital of 10 million yuan, Earlysun is an innovative new materials technology and product development company, committed to cost-effective and environmentally friendly LED encapsulation materials, solder paste packaging materials, adhesive colloid encapsulation materials and other fine chemical materials development and production, is China's power semiconductor and integrated semiconductor packaging solder national innovative enterprise leader and LED packaging materials.
