Fulltronics Corporation Ltd. >> 6 Layer Printed Circuit Board

6 Layer Printed Circuit Board

Name: 6 Layer Printed Circuit Board
Brand: china-manufacturer-directory.com
SKU: 729513395
Availability: InStock
Rating: 5 (90 reviews)

Supplier:	Fulltronics Corporation Ltd.
Price:	US $ 1/Piece
Min Order:	5/Piece
Quantity::
Trade Terms:	FOB,DAP,EXW

Product Specifications

Prod Model:	FCPCB064A
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Solder Mask:	Green
Silk Screen:	White
PCB Thickness:	1.6mm
Type:	Rigid Circuit Board
Dielectric:	FR-4
Material:	Fiberglass Epoxy Resin + Polyimide Resin
Flame Retardant Properties:	V0

Product Description

OEM/ODM/EMS Services for PCBA:

PCBA, PCB Board assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting

Capability - SMT

Lines 9(5 Yamaha,4KME)
Capacity 52 million placements per month
Max Board Size 457*356mm.(18"X14")
Min Component size 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP
Speed 0.15 sec/chip,0.7 sec/QFP

Capability - PTH

Lines 2
Max board width 400 mm
Type Dual wave
Pbs status Lead-free line support
Max temp 399 degree C
Spray flux add-on
Pre-heat 3

Technical Data:

Stencil size/range:

736x736mm

Minimum IC pitch:

0.30mm

Maximum PCB size:

1200x 500mm

Minimum PCB thickness:

0.35mm

Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:

74x74mm

BGA ball pitch:

1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm (minimum), 2.54mm (maximum)

Frequency of stencil cleaning:

1 time/5 to 10 pieces

Turn Times:

Quick turn are our Specialty

Volume:

One piece to low valume production quantityes

Low cost first article builds

Schedule deliveries

Assembly type:

Surface mount(SMT) assembly

Thru-hole

Mixed(surface mount and thu-hole) technology

Single or double sided placement

Cable assembly

Components type:

Passive components:

As small as 0402 package

As small as 0201 with design review

Ball Grid Arrays(BGA):

As small as .5mm pitch

Stencil:

Laser cut stainless steel

Parts procurements:

Turnkey(we supply the parts)

Consigned(you supply the parts)

You supply some parts, we do the rest

Solder type:

Leaded

Lead-free/ROHS compliant

Other capabilities:

Repair/rework services

Mechanical assembly

Box build/electromechanical assembly

Mould and plastic injection.

Fulltronics Corporation Ltd is a manufacturer and exporter specializing in Printed Circuit Board fabrication, Assembly and development from the start of 2002

In the early years our core business consist of fabrication of prototypes pcbs, High frequency pcbs, multilayer pcbs, flex pcbs and rigid-flex pcbs for companies of home and abroad. All PCBs are manufactured with advanced quality control systems and are recognized by ISO-9001 and TS16949, UL Certification and ROSH. In 2006 Fulltronics set up an assembly house enabling us to offer a fully integrated array of services, including SMT Assembly, T/H Through Hole Assembly, wire Assembly, Box-build&assembly and functional testing to ensure the highest level of quality control. You can choose any of the procedure you need.

Today our products are applied for medical, defence, broadcasting, telecommunication systems, Industrial control, traffic intelligence systems, auto industry, agriculture and so on. We manufactured products keeping high pace with newly technology developments. Fulltronics Corporation combines fashion and application well to satisfy diverse of customers requirments.

For the most, we take pride in providing excellent quality Products at very competitive prices, outstanding service and timely delivery. If you have any PCB or PCB Assembly projects, just give us opportunities, we perfect your ideas.