Categories
Price: | Negotiable/Piece |
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Trade Terms: | FOB,DAP,EXW |
Min Order: | 1/Piece |
Pay Type: | T/T |
Prod Model: | xml-50 |
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Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
Structure: | Multilayer Rigid PCB |
Production Process: | Subtractive Process |
Material: | Epoxide Woven Glass Fabric Laminate |
Factory Manufacture Capability | ||
NO | ITEM | Techinical capabilities |
1 | Materials | CEM-1 CEM-3 FR-4 High-TG Teflon Rogers etc. |
2 | layers | 1-16 layers |
3 |
Min. core material |
5mil(excluding copper) |
4 | Prepreg type | 7628 2116 1080 3313 |
5 | Max. board size | 520*720mm |
6 | Copper thickness | min. base copper 1/3 OZ |
max. finished copper6OZ | ||
7 | Min. board thickness | 2- layer 10mil |
4- layer 16mil | ||
6-layer 24mil | ||
8-layer 32mil | ||
10-layer 40mil | ||
8 | Max. board thickness | 236mil(finished board thickness) |
9 | Min. line width/space | 3mil/3mil HOZ copper base(inner layer) |
10 | Min. hole size | 8mil |
11 | PTH wall thickness | ≥ 1mil |
12 | Hole dia. tolerance | ± 3mil |
13 | Hole dia. tolerance | ± 2mil |
14 | Countersink hole | Min. depth(D)6mil; The Depth of tolerance± 6mil |
15 | Drilling hole positional deviation(outer layer) | 1st-drill ± 3mil(Normal) ± 2mil(min. ) |
2nd-drill ± 4mil | ||
16 | Min. solder mask bridge | 3.2mil(HOZ base copper, green) |
17 | Outline tolerance | ± 4mil |
18 | Twist & Bow | ≤ 0.75% |
19 | Peelable mask thickness | ≥ 8mil 1 printing |
20 | Insulation Resistance | > 10MΩ Normal |
21 |
Through hole resistance |
≤ 100Ω Normal |
22 | Current breakdown | 10A |
23 | Peel strength | 1.4N/mm |
24 | S/M abrasion | > 5H |
25 | Thermal stress | 28 degrees 20Sec 3Times |
26 | Test Voltage | 20-300V |
27 | Min. blind/burried via | 8mil |
28 | Surface finish | HAL ENIG IMAG IMSN OSP HAL+G/F ENIG+G/F |
29 | Impedance control | Single ended impedance 50Ω /70Ω ± 10% Normal |
Differential impedance 90Ω /100Ω ± 10% Normal | ||
30 | Max. aspect ratio | 12: 1 |