Product Specifications
| Markets: |
North America,South America |
| Material: |
Diamond |
| Types: |
Surface Grinding Wheel |
| Abrasive: |
Superabrasive |
| Working Style: |
Tool Grinding |
| Shapes: |
Edge Shape |
Product Description
Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our instiute which possess superior grinding performance and high cost performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.
The Company, located in Zhengzhou High-tech Zone, is a high-tech enterprise which is professionally engaged in research & conduct of high-precision superhard material tools. It is in a domestic leading position in the field with perfect quality & flexible service, but also welcome internationally.
The company is committed to developing and manufacturing high-precision diamond tools, including metal bond diamond tools, resin binder diamond tools and vitrified bond diamond tools with more than 600 tapes of products which are applied in optical glass, electronic material, magnetic material, precision ceramics, semi-conduct material, crystal material and so on.
The Company is managing to increase its core competitive ability and make its goal come true.
