Diamond Wire, Diamond Wire for Sapphire, Cutting Silicon, Waffer Cutting, Semiconductor Processing, Wire Cutting

Product Specifications

Prod Model:	DW 120-500
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Diameter:	0.33mm
Core Wire:	0.25mm
Diamond Grit:	35~40microns
Break Strength:	165 N
Manufacturing Arts:	Electroplating
Usage:	Arts Cutting
Thickness:	0.1~0.50
Shape:	Single Straight
Kind:	Processing of Sapphire
Brand:	Xinya
Saw Blade External Diameter:	0.10mm~0.50mm
Specification:	0.1~0.50

Product Description

Diameter (mm)	Core wire (mm)	Diamond Grit (microns)	Type of technical	Break strength (N)	Length of one spool (KM)
0.10	0.08	8~10	Electroplated	35	50
0.12	0.10	8~10	Electroplated	45	50
0.15	0.12	10~15	Electroplated	55	50
0.25	0.18	35~40	Electroplated	95	40
0.33	0.25	35~40	Electroplated	165	40
0.39	0.30	45~50	Electroplated	235	40
0.42	0.33	45~50	Electroplated	285	40
0.45	0.35	45~50	Electroplated	320	40
0.50	0.38	50~60	Electroplated	425	40

  Electroplated diamond wire is a type of fixed abrasive diamond wire. It's used for cutting Semiconductors material, such as silicon, sapphire. Based on the abrasion and cutting principle between the abrasive fixed on the steel wire and the workpiece materials, the abrasive particles do not directly act on the wire saw. Such rigid cutting method greatly improved the cutting efficiency.
  Product advantages:
1) Capable of cutting large-sized ingots; Material-saving, high-efficiency and cost-effective
2) Capable of cutting materials with high rigidity and high brittleness such as sapphire
3) Little damage on the processed surface, little deformation
4) Thin slices, with uniform thickness.
  In the processing of the electroplated diamond wire,the heating temperature of the diamond is less than 100ºC,so the damage to the diamond is very small,then the Electroplated Diamond Wire can also have the good long life time.
  Try it,and you will love it!
  Customized size available on request.