Diamond Wire for Sapphire Wafering

Changsha DIAT New Material Sci. & Tech. Co., Ltd. is a high-tech enterprise specializing in R&D, manufacture and service for the hard brittle materials cutting such as monosilicon, polysilicon, sapphire, crystal, glass, CaF2, SiC, GaAs, Ge, W alloy, magnetic materials and so on. Our leading products are electroplated diamond wires, diameter sizes are available from 0.12mm to 0.42mm presently, which are used to square, brick, crop, dice, slice, wafer the hard brittle materials on single wire cutting machine and multi-wire cutting machine. We are the first enterprise carrying the electroplated diamond wires into industrialization in China.