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| Supplier: | Xiamen Bolion Circuit Co., Ltd. |
|---|---|
| Price: | US $ 0.2-0.3/Piece |
| Min Order: | 1/Piece |
| Quantity:: | |
| Trade Terms: | FOB,CFR,CIF |
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| Prod Model: | B10187 |
|---|---|
| Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Min.Space: | 0.175mm |
| Min. Line: | 0.127mm |
| Min. Pth: | N/a |
| Stiffener: | N/a |
| Surface Treatment: | Hard Gold |
| ISO9001:2008: | Quality Management Qualification |
| ISO/Ts 16949: | Automotive |
| ISO 13485: | Medical Devices |
| ISO 14001: | Environmental Qualification |
| Type: | Flexible Circuit Board |
| Material: | Paper Phenolic Copper Foil Substrate |
| Flame Retardant Properties: | V0 |
1. Over 10 years'manufacturing experience focus on flexible circuit industry area.
2. Assembly provided.
3. 100% quality tested before shipment.
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted.
7. 3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc

| Main Technique Index | ||
| Description | Parameters | |
| Polyimide | Polyester | |
| Base film Thickness (um) | 12.5,25,35,50 | 12.5,25,35,50 |
| Copper Thickness (um) | 12,17.5,35,50,70,105 | |
| Min. Line Width/Line Space (mm) | 0.075/0.075 | |
| Min. Hole Size (mm) | 0.15 | |
| Tolerance (mm) | Outline:+/-0.05; Coverlay: +/-0.2 | |
| Peel Strength (kgf/cm) | Above 1.0 | Above 0.8 |
| Solder Resistance | 260C 10 seconds | 204C 5 seconds |
| Surface Treatment | ||
| Content | Normal coating thickness | Normal PNL size |
| Plating nickel gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating hard gold (In house) | Ni:2-9um;Au:0.1-1.0um | 300mm×400 MM |
| Plating soft gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating pure tin (In house) | 2.0-8.0um | 300mm×400 MM |
| Immersion Tin (In house) | 0.3-0.6um | 300mm×400 MM |
| OSP (In house) | N/A | 300mm×400 MM |
| ENIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENIG (Soft Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENEPIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| HASL (Outsource) | Cover the pads with min thickness 1~2 um | 300mm×400 MM |
| Immersion silver (Outsource) | Per standand creteria | 300mm×400 MM |
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