Product Specifications
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Manufacturing Technology: |
Optoelectronic Semiconductor |
| Material: |
Hermetic Package |
| Type: |
Optoelectronics Semiconductor |
Product Description
9mm (SOT148) headers are widely used to package high power laser diode. Typycally, SOT148 header is build with CRS Flange, which limits to evacuate the heat for high power laser diodes, especially for blue, green laser didoes. Our Full Copper 9mm (SOT 148) header has following features:
1. The Flange is made from Full Copper, instead of CRS.
2. Isolated with white ceramic eyelet, instead of glass.
Our configuration is proven to be lot better performance. As Full Copper Flange can help to evacuate the heat, thus to achieve higher power.
SStreamtek Electronics was found in 1998 and started the operation in China since 1999, our mission is to be a global supplier and a solution provider of hermetic packages and assemblies with expected high quality at competitive price; Streamtek has two business unit: Glass to metal Seal and Ceramic to metal Seal; And offers wide variety of high reliability hermetic packages that are used in applications of: Military, Aerospace, Aviation, Power electronics, Bio-Medical, Automotive, Telecommunications, MEMS Sensor, Hybrid IC Indutries.
1. Full solution of hermetic packages for Power devices that widely used in Aerospace, Aviation, Power Electronics industries. These packages are manufactured per China Military Standard GJB923A-2004 (MIL-STD-19500) and screened per: MIL-STD-38354. All these packages are sealed with Ceramic eyelet for excellent performance and high reliability, we have full production lines for:
1.1. SMD Package, Such as SMD-0.5, SMD-1, SMD-2, etc
1.2. Ceramic-eyelet To Package: To254, TO257, TO258, TO259, Z shape base is always available; With BeO, Moly, GLIDCOP, W/Cu.
1.3. Ceramic eyelet Hybrid hermetic Package
1.4. Ceramic eyelet Thick film Hybrid hermetic Package
1.5. Ceramic eyelet TO Header
1.6. Ceramic Seal Hermetic Stud Package
1.7. Ceramic-seal Hockey Puk Hermetic Package.
2. Photonics Packages
2.1 Butterfly package with Ceramic Eyelet, HTCC Multiple-layer Ceramic Feedthru, Glass Eyelet, with GPO or Window-lens
2.2. HHL Package with Ceramic Eyelet, Glass Eyelet
2.3. DIL/DIP package with Ceramic Eyelet, Glass Eyelet
2.4. Compact Power package with Ceramic eyelet package
2.5. To header with Ceramic Eyelet, Glass Eyelet
2.6. Package integrate with GPO/Window-lens
2.7. Packages for Modulators
4. Glass to metal Seal Sensor Header
1. Stainless Steel Sensor Header, 13mm, 19mm
2. To5 Header, To8 Header
5. Glass to metal Seal Hybrid IC Package
1. DIL/DIP package
2. Flat-packages
3. Platform packages
