Product Specifications
| Prod Model: |
c1-pos |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Oceania,Western Europe |
| Surface Finish: |
Immersion Gold |
| Cu: |
1 Oz |
| Thickness: |
1.6mm |
| Type: |
Rigid Circuit Board |
| Dielectric: |
FR-4 |
| Material: |
Fiberglass Epoxy Resin + Polyimide Resin |
| Flame Retardant Properties: |
V0 |
Product Description
Quality Assurance: UL: E352422; ISO14001: 128630; ISO9001: 128629
1. IPC standar: IPC-A-600G
2. Board thickness: 0.2mm-6.0mm
3. Laminate: FR-4, Taconic, Rogers, TG170, TG180, CEM-1.
4. Layers: SS, DS, ML, Single side, Double side, Multilayer, 1-24Layer
5. Outer / inner Coppers: 1/1 oz, 1/2 oz, 2/2 oz, 2 oz, 3 oz, 4 oz.
6. Multilayer stack up: Stack up, controlled impedence.
7. Pcb size: Unit size, panel size, tooling strips, tooling holes and fudicials.
8. Min hole size: 0.2mm
(Shape tolerance± 0.13mm, hole tolerance: PTH± 0.075mm; NPTH: ± 0.05mm)
9. Min line width: 0.1mm
10. Min line spacing: 0.1mm
11. Solder mask color: Green, Blue, Red, Black, Yellow, White
12. Legend color: White, Yellow, Black, Blue, Red
13. Surface finshed: HAL(Tin / Lead), HAL(Lead Free), Immersion gold, Immersion Silver,
Immersion Tin, Gold Plated(Soft Gold), OSP(ENTEK).
14. Certificate: UL, ISO9001, ISO14001, SGS, RoHS, QS9000.
15. Profiling: CNC, Routing, Punching, Beveling, V-cut, V-score, Counter sink.
16. Test: E-test, Fixture, Fly-test.
17. Special technique: Buried and bling vias, controlled impedance, BGA.
18. Package: Vacuum package, Seal package.
19. Shipping: FOB HongKong, CIF, Air Transportation, DHL, UPS, Fedex.
Shenzhen Posin Circuit Technology Co., Ltd. was established in April, 2008, After
years'efforts, the company has expanded rapidly and keptIntroducing
new production equipments. We have also trained a professional team
and perfected the quality management system ranging. the
manufacture ability of our company is expanded rapidly. The annual
output of double-sided and multi-layer PCB exceeds 100, 000
square meters.
