Product Specifications
| Prod Model: |
A-SAC405 |
| Metal Coating: |
Tin |
| Mode Of Production: |
SMT |
| Certification: |
SGS |
| Customized: |
Customized |
Product Description
Feature:
BGA solder ball for notebook in hot sale
Leaded solder ball
Supior quality, best service
Fast delivery
Specification:
1. Package: 250K/500K per bottle (custom-order is available).
2. Diameter: 0.100mm-0.300mm, 0.350mm-0.400mm, 0.450-0.550mm, 0.600mm-0.650mm, 0.760mm (optional).
3. Alloy composition: Sn/AG4.0/Cu0.5.
4. Melting point: 217-219Centigrade.
5. Intensity: 5.34kgf/mm
6. Extending degree: 48%.
Chongqing Qunwin Electronic Materials Co., Ltd. is a Taiwan-funded enterprise, it combines experts and professional skills, with a total investment amount of $30 million and a registered capital amount of $30 million. Our company specialized in researching, producing and selling semiconductor and SMT encapsulation application-specific BGA solder, electroplating solder, solder paste, tin, flux etc. We own many items of patented technology, and hold the patented technology of Taiwan and China atomization forming BGA solder. Our finished products project had been listed into 100 technological innovation projects in 2008 by Chongqing economic committee, and placed in 11th. Products are up to standard of JIS Z3282, and we have been authorized by US. HENKEL CORPORA TION and JOHSON MANUFACTURNG COMPANY together with US. IOW university research fund. All products are SGS certificated.
