IC Tester Chip Test Socket Data Reader Recovery BGA162 (eMCP) Socket SD Solution_12X16mm Premium Emmc / Nand Flash Test & Burn-in Socket

Product Specifications

Prod Model:	702-00000086
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Pitch:0.5mm:	Pin Count:162
IC Size:12X16mm:	Structure:Clamshell
Package:BGA:	Contact:Spring Probe

Product Description

The SD solution is designed for test, debug, validation, and programming of eMMC, eMCP devices
The SD solution provides a compact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development. 
 
Test, debug, validation, and programming of  eMMC, eMCP devices
Failure analysis / System and wafer test
Package and Chip qualification
Production prototype / Data recover
 
Suitable for devices of  Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston etc eMMC and eMCP.
Support eMMC version: ≤eMMC5.0.
Support hot plug, eMMC can be directly connected to PC with SD card reader.
Realize reading, accessing and writting data for eMMC and eMCP devices
 

Mechanical Socket Body: PPS Socket Lid: AL Contact: Spring Probe Operation Temperature: -40ºC to 140ºC Life Span at Operating Travel:100K min. Cycles Spring Force:27g per Pin

Electrical Current Rating (Continuous) : 2.59A Self Inductance:1.57nH Bandwidth -1dB:10GHz DC Resistance: 42mohm

Place a Device by hand on to the socket. Lock the lid. Connect to PC by SD Card Reader. Now it is ready for use.