Product Specifications
| Prod Model: |
E1 |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
Product Description
E1 is designed to be suitable for most of the four units IGBT module
Package.
1. Designed as a convex relative to a plane
2. All covered by aluminum alloy
3. Welding porosity <5%
Material: AlSiC8
Size: 137*127*5mm
Through hole: Custom design
Screw holes: Custom design
Non-welding surface: Spherical
Spherical height: 30-300μm
Surface: Aluminum alloy
Plating: Semi-bright nickel; Bright nickel; Nickel boron; No coating
Solder mask: Optional
Package: Sealed, vacuum, collision resistance
Miqam has been producing quality Aluminum Silicon Carbide (AlSiC - metal matrix composite) parts since 2004, Miqam AlSiC has been widely used on aerospace, military and civil microelectronics packaging area.
AlSiC is the most affordable and ideal material for thermal management application in power electronic packaging, LED thermal management and microwave packaging, etc.
Low cost mass manufacture AlSiC metal matrix composite materials for thermal management of electronic components, are special packaging materials, which combine aluminum alloys with high volume fraction SiC to form materials featuring low density, high thermal conductivity and low CTE. The AlSiC composites are fabricated by infiltrating molten aluminum alloys into porous SiC perform under vacuum and regulated pressure.
1. CTE matched to ceramics and semiconductors
2. Higher thermal conductivity than most metals
3. Light weight, 1/3 the weight of copper
4. High rigidity and strength
5. Low cost mass manufacture
