Product Specifications
Product Description
1. Discrete circuit lead frames:
TO-92A2, TO-92B2, TO-92C2, TO-237, TO-126, TO-3P, TO-220,
TO-263, TO-247, TO-251/252
2. Integrated circuit lead frames:
DIP8L, DIP14L, DIP16L, DIP18L, DIP20L, DIP22L, DIP24L, DIP28L,
DIP-30L, DIP-36L, DIP40L, DIP42L, SOP8L, SOP10L, SOP14L,
SOP16L, SOP18L, SOP20L, SOP24L, SOP28L, SOP30L, SSOP16L,
SSOP18L, SIP8L, SIP9L, SIP9LF, SIP10L, SIP13L
3. Surface mount lead frames:
SOT-23A, SOT-23B, SOT-23C, SOT-89,
UPC10L, UPC14L
Xiamen Lifa Electronics Co., Ltd. is a high-tech and export-oriented company committed to the production and development of stamping lead frames, trim/form tools and encapsulation moulds for semiconductor industry. The company locates in Xiamen, the port city and one of the four special economic zones of China.
We provide a comprehensive range of integrated circuit lead frames and discrete devices lead frames including TO-92 Series, TO-126 series, TO-220 series, TO-3P series, SOT (Small Out-line Transistor) series, SOP (Small Out-line Package) series, SSOP (Shrink Small Out-line Package) series, PDIP ( Plastic Dual In-line Package) series, SPDIP (Shrink Plastic Dual In-line Package) series, SIP (Single In-line Package) series, QFP (Quad Flat Package) series, PLCC (Plastic Leaded Chip Carrier) series, UPC series and so on. In order to meet overall customer requirements, we also provide customed stamping tools, trim/form tools and encapsulation moulds.
With our professional technologies and experienced personnel, by importing advanced electroplating lines and high speed precision stamping presses, implementing ISO9001 standards to strive for perfect quality, We aim to be one of the best suppliers in Asia on stamping semiconductor lead frames.
