Product Specifications
| Prod Model: |
Jn004-13120307 |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Type: |
Rigid Circuit Board |
| Dielectric: |
FR-4 |
| Material: |
Fiberglass Epoxy |
| Flame Retardant Properties: |
V0 |
Product Description
4L battery protection circuit board with LPI black solder-mask
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Number of Layers: 4L
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Base-Material: FR4
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Thickness: 1.6mm +/-10%
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Final-Cu: 35um
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Cu Inner-Layer: 17.5um
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Cu in the Hole: 25um
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Mech. Treatment: Routing and Scoring
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Surface: HASL
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Solder-Mask: Double-side, Black matte(dull)
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Add. Via-Print: Without
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Legend-Print: Double-side, White
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Blue-Mask: Without
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Peelable: Without
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Carbon-Print: Without
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Impedance: Without
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Marking: UL + Date on TopSide in silkscreen layer
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E-Test: Yes
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|
NO |
ITEM |
Techinical capabilities |
|
|
1 |
Materials |
CEM-1 CEM-3 FR-4 High-TG Teflon Rogers etc. |
|
|
2 |
layers |
1-16 layers |
|
|
3 |
Min.core material |
5mil(excluding copper) |
|
|
4 |
Prepreg type |
7628 2116 1080 3313 |
|
|
5 |
Max.board size |
520*720mm |
|
|
6 |
Copper thickness |
min.base copper 1/3 OZ |
|
|
max.finished copper6OZ |
|
|
7 |
Min.board thickness |
2- layer 10mil |
|
|
4- layer 16mil |
|
|
6-layer 24mil |
|
|
8-layer 32mil |
|
|
10-layer 40mil |
|
|
8 |
Max.board thickness |
236mil(finished board thickness) |
|
|
9 |
Min.line width/space |
3mil/3mil HOZ copper base(inner layer) |
|
|
10 |
Min.hole size |
8mil |
|
|
11 |
PTH wall thickness |
≥1mil |
|
|
12 |
Hole dia.tolerance |
±3mil |
|
|
13 |
Hole dia.tolerance |
±2mil |
|
|
14 |
Countersink hole |
Min.depth(D)6mil;The Depth of tolerance± 6mil |
|
|
15 |
Drilling hole positional deviation(outer layer) |
1st-drill ±3mil(Normal) ±2mil(min.) |
|
|
2nd-drill ±4mil |
|
|
16 |
Min.solder mask bridge |
3.2mil(HOZ base copper, green) |
|
|
17 |
Outline tolerance |
±4mil |
|
|
18 |
Twist & Bow |
≤0.75% |
|
|
19 |
Peelable mask thickness |
≥8mil 1 printing |
|
|
20 |
Insulation Resistance |
>1012Ω Normal |
|
|
21 |
Through hole
resistance |
<300Ω Normal |
|
|
22 |
Current breakdown |
10A |
|
|
23 |
Peel strength |
1.4N/mm |
|
|
24 |
S/M abrasion |
>6H |
|
|
25 |
Thermal stress |
28 degrees 20Sec |
|
|
26 |
Test Voltage |
20-300V |
|
|
27 |
Min.blind/burried via |
8mil |
|
|
28 |
Surface finish |
HAL ENIG IMAG IMSN OSP HAL+G/F ENIG+G/F |
|
|
29 |
Impedance control |
Single ended impedance 50Ω/70Ω±10% Normal |
|
|
Differential impedance 90Ω/100Ω±10% Normal |
|
|
30 |
Max.aspect ratio |
12:1 |
|
Shenzhen X-Mulong Circuit Co., Ltd. is a professional Manufacturer of Printed Circuit Boards. Established in 2007, the company sticks to make the best printed circuit boards with high quality, high precision and multi-species. There are two factories, totally 6500 square maters. We can supply up to 16-layer PCB.
Nowadays we supply a monthly capacity of 12, 000 sq. m for samples and small to middle-sized volumes, but our production capacity can reach 15, 000 sqm/1500 part numbers per month. We continuously invest big capital in purchasing advanced equipments. Meanwhile, in order to ensure the production process stability and excellent quality, we introduce all-round monitoring and mature quality management system. As we always stick to the principle of "quality first, credit upmost, continuous improvement and customer satisfaction", we serve customers thoughout the world with excellent quality and competitive price. Our customers are mainly from Europe, America and Asia.
So, discover ShenZhen X-Mulong Circuit. You'll find us to be a market-focused enterprise that has the proven processes and dedicated people to deliver printed circuit boards at the Price, Quality and Timing you want.
