Product Specifications
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| 14 Layer: |
RoHS |
| Type: |
Combining Rigid Circuit Board |
| Dielectric: |
FR-4 |
| Material: |
Fiberglass Epoxy |
| Flame Retardant Properties: |
V0 |
Product Description
14 Layers
Material: FR4 (Tg 170), CTI>=600'C
Finished thickness: 2.4mm
Finished Copper: 1 o/z (outside), 0.5 - 1 o/z (inside)
Min Hole Size: 0.1mm
Min Line & Width: 4/4 mil
Solder Mask: Green Color
Surface: Immersion Silver
Panel Layout: 264.0mm x 178.6mm
Layer Structure: 2 + 10 + 2.
Multech Electronic Limited specializes in manufacturing Printed Circuit Boards from 2 to 24 layer. We offer quick-turn, high technology printed circuit boards in prototype and moderate production volumes. All of which are manufactured at our modern production plant in China.
In an increasingly competitive nowadays, Base material unceasingly rises, the pressure of competition continuously appear to every enterprise, so reduce the purchase cost became to the most important action in all enterprise. Well, In gazillion PCB factory in Chinamainland, MULTECH is one of PCB Manufacturer that you search for high quality and low cost.
We go on where other companies want to stop.
We can always provide you with the latest technologies because of our close cooperation with Universities and R&D departments.
We always are in close contact with material suppliers and want to test their latest material that they want to bring on to the market.
In this modern world where change is a daily common thing it's good to have a partner like "MULTECH".
We are more than happy to make your thoughts reality and make your first design to a real live Printed Circuit Board.
We are ISO9001 certificated, and UL approved. Follow up IPC-600F Class 2 standard.
Our Capability:
No. Of Layers Available 1- 24
Base material: FR4, CEM1, CEM3, ALU, FR2, FR1, Polymide, Rogers, Arlon, Teflon)
Flux Coat, Flash Gold, HASL, Immersion Gold & OSP
Min. Line Width: 0.08mm
Min. Line Spacing: 0.08mm
Min. Annual Ring PTH: 0.15mm
Non-PTH: 0.20mm
Min Hole Size PTH: 0.1mm
Non-PTH: 0.15mm
Hole Aspect Ratio: 10
Min. Board Thickness Single & Double Sided 0.2mm
Multilayer (4, 6, 8, 10) 0.4mm, 0.55mm, 0.8mm, 0.8mm
Max Board Size: 600mm X 900mm, 400*1200mm
Solder Mask Pitch: 0.1mm
Hole Tolerance: PTH +/-0.05mm
Non-PTH: +/-0.05mm
Hole Position Tolerance: +/-0.05mm
Outline Tolerance Routing: 0.15mm
Punching: +/-0.15mm
Thickness Tolerance: MIL-P-13949 Class 2
V-Cut Tolerance Depth: +/- 0.10mm
Position: +/-0.10mm
Gold Finger: 5 u" - 50 u".
