Nand Flash (THGBM4G4D1HBAIR THGBM5G5A1JBAIR* THGBM5G6A2JBAIR* THGBM5G7A2JBAIM* THGBM5G8A4JBAIM* THGBM5G9B8JBAIE* THGBM4T0DBGBAIJ)

Product Specifications

Prod Model:	16Gb TC58NVG4D2HTA00 2GB THGBM4G4D1HBA 16GB THGB
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Manufacturing Technology:	Logic IC
Type:	Intrinsic Semiconductor
Package:	Tssop14

Product Description

4GB THGBM5G5A1JBAIR THGBM5G5A1JBAIR is 4-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is
Utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBM5G5A1JBAIR has an industry standard MMC protocol for easy use.

FEATURES
THGBM5G5A1JBAIR Interface
THGBM5G5A1JBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported.
-
200MHz SDR / Sanitize / Discard / Packed command 8/ Power off notification / Large sector size

8GB THGBM5G6A2JBAIR THGBM5G6A2JBAIR Toshiba Flash Card 8GB 3.3V NANDrive
8GB THGBM5G6A2JBAIR
THGBM5G6A2JBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBM5G6A2JBAIR has an industry standard MMC protocol for easy use.

16GB THGBM5G7A2JBAIR THGBM5G7A2JBAIR is 16-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G7A2JBAIR has an industry standard MMC protocol for easy use. FEATURES THGBM5G7A2JBAIR Interface THGBM5G7A2JBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported. - 200MHz SDR / Sanitize / Discard / Packed command / Power off notification / Large sector size

32GB THGBM5G8A4JBAIR THGBM5G8A4JBAIR is 32-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is
Utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBM5G8A4JBAIR has an industry standard MMC protocol for easy use.

FEATURES
THGBM5G8A4JBAIR Interface
THGBM5G8A4JBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported.
-
200MHz SDR / Sanitize / Discard / Packed command / Power off notification / Large sector size

64GB THGBM5G9A8JBAIG THGBM5G9A8JBAIG is 64-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G9A8JBAIG has an industry standard MMC protocol for easy use. FEATURES THGBM5G9A8JBAIG Interface THGBM5G9A8JBAIG has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported. - 200MHz SDR / Sanitize / Discard / Packed command / Power off notification / Large sector size

64GB THGBM5G9B8JBAIE THGBM5G9B8JBAIE is 64-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is
Utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBM5G9B8JBAIE has an industry standard MMC protocol for easy use.

FEATURES
THGBM5G9B8JBAIE Interface
THGBM5G9B8JBAIE has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported.