Anqing Hongyu Chemical Co., Ltd. >> Polyamide Hot Melt Adhesive as Seal Material in Electronic Components (HY-208)

Polyamide Hot Melt Adhesive as Seal Material in Electronic Components (HY-208)

Polyamide Hot Melt Adhesive as Seal Material in Electronic Components (HY-208)
Price: US $ 2350-2500/Ton
Trade Terms: FOB,CFR,EXW
Min Order: 1/Ton
Pay Type: L/C,T/T
Company Information

Anqing Hongyu Chemical Co., Ltd, established in 1999, is a professional manufacturer leading by science and technology, engaged in the research, development, production, sale and service of polyamide resin, dimer acid and monomer fatty acid.


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Polyamide Hot Melt Adhesive As Seal Material In Electronic Components

Dedicated to strict quality control and thoughtful customer service, our experienced staff members are always available to discuss your requirements and ensure full customer satisfaction, and we make the products under the international quality requirements and have a good control for the whole flow of development, purchasing, manufacturing, analysis, inspection, sales and marketing service.
Polyamide Hot Melt Adhesive As Seal Material In Electronic Components HY-208
Appearance Yellowish granulated transparent solid
Brief introduction Polyamide hot melt adhesive formed by the high temperature condensation reaction of dimer
acid and multi-dimensional amine. It is able to dissolve in general organic solvent. Its melt
viscosity has great relationship with the temperature. Low viscosity, good flow performance,
excellent flexility and strong cohesive force.
Properties Good flow performance
Excellent flexility and low viscosity
Strong cohesive force
Major application Hot melt adhesive as seal material in electronic components, decoration in automobile.
Hot melt adhesive of shoes, fabric, wood, plastic, metal and ceramic.
Hot melt adhesive of packing material, and so on.
Specification Acid value (mgKOH/g) ≤10
Amine value (mgKOH/g) ≤18
Viscosity (mpa.s/160) 2000-6000
Softening Point (°C) 100-180
Color (Fe-co) ≤8
Water absorption (%) ≤0.5
 Shear strength (mps, AL/AL) ≥4
Peeling strength (N/25mm, PE/PE, 60±2°C) ≥100
Packing Paper-plastic bag, 25kg/bag
Prod Model: HY-208
Markets: North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
CAS No.: 63428-84-2
Mf: (Corconhr1nh)N
Place Of Origin: Anhui, China (Mainland)
Type: Polymer
Brand Name: Hongtai
Keyword: Polyamide Hot Melt Adhesive
Package: Paper-Plastic Bag, 25kg/Bag
Established Year Of The Factory: in The Year of 1998
Monthly Output: 100, 000mt
Factory Area: 62400square Meter
Classification: Hot Melt
Morphology: Solvent
Application: Packing
Material: Polyimide
Color: Yellow
Characteristic: Waterproof
Anqing Hongyu Chemical Co., Ltd is established in 1999, which is an enterprise leading by science and technology, owning advanced molecular distilling equipment. We mainly deal with the products made of polymer resin and manufacture polyamide resin, Polyamide Hot melt Adhesive, Monomer Fatty Acid and Dimer Acid.

Hongyu is in Anqing city, famous for its history, culture and beautiful landscape. It locates in Weier Lu, Economy& Technology Developping Area, with convenient water and land transportation, closing to the port of Yangtze River, national 206 express way, trial way and Anqing airport. The products can be carried to above-mentioned places with ten minutes.

Hongyu has the modern workshops, occupied 24000 square meters. We make the products under the international quality requirements and have a good control for the whole flow of development, purchase, manufacture, analysis, inspection, sales and marketing service. We provide the high-quality products and technology support and ensure the good quality for the customer's products.

Our company becomes stronger and stronger in the competition. We are so grateful for the support from the government and the customers. We will create the brighter future together with the customers.

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