Categories
| Supplier: | Shenzhen Rigao Electronics Co., Ltd. |
|---|---|
| Price: | US $ 2/Piece |
| Min Order: | 1/Piece |
| Quantity:: | |
| Trade Terms: | FOB |
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| Prod Model: | Rigao06 PCB88 |
|---|---|
| Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Surface Finishing: | HASL |
| Solder Mask: | Green, Blue, Black,Red |
| PCBA Testing: | X-ray, Aoi |
| Small Order: | Acceptable |
| PCB Assembly Clone: | Acceptable |
| MOQ: | 1PCS |
| PCB Testing: | E-Testing |
| Products Name: | Electronic Circuit Boards |
| Silk-Screen: | White |
| Copper Thickness: | 1oz |
| Type: | Rigid Circuit Board |
| Dielectric: | FR-4 |
| Item | PCB Capability |
| Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, PTFE, TACONIC, F4B, ARLON, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc. |
| ayers (GERBER FILE) | Mass production: 2~58 layers & Prototyping run: 64 layers |
| Board Thickness | 0.2mm - 7mm |
| Copper Thickness | 1/2 oz - 14 oz |
| Surface Treatment | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
| Data File Format | Gerber file, Protel, OrCAD, PADS2000 , Altium, Powerpcb , ODB++, EDA, |
| Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
| Hole Size Tolerance | +/-0.05mm (2 mil) |
| Min. Line Width and Spacing | 0.1mm (4 mil) |
| Min. Solder Mask Clearance | 0.076mm (3mil) |
| Min. Annular Ring | 0.076mm (3mil) |
| Max. Panel Size | 1150mm × 560mm |
| Max. Copper Thickness | UL certificated: 6.0 OZ & Prototyping run: 12OZ |
| Profile and V-Cut | V-Cut, Jump V-Cut, CNC V-Cut CNC-Routing, Stamping and Beveling |
| Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
| Type of PCB Assembly | SMT, Thru-hole,COB |
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 7mm | |
| Wave Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Supporting: | Software burning and Function Testing |
| Testing | X-RAY Inspection & AOI Test, ICT,Probe flying,burn-in,function test,temperature cycling |
| Lead Time | 12days-15days |
| File Fomat | Bill of Materials,Gerber Files, Pick-N-Place File (XYRS),PCB,Altium, EDA etc |
| HDI board | 1-layer PCB | 2-layer PCB | 4-layer PCB | 6-layer PCB |
| 8- layer PCB | 10- layer PCB | 12- layer PCB | 14- layer PCB | 16- layer PCB |
| Aluminium PCB | Multi-layer PCB | FPC | Rigid-flexible PCB | Copper PCB |
| PCB Assembly | Rigid circuit board | LED PCB |
1. | Material |
2. | Board Thickness |
3. | Copper Thickness |
4. | Surface Finishing |
5. | Quantity |
6. | Gerber File |
7. | BOM list |
Layer | Sample | mass production |
| 1 | 4 days | 7 days |
| 2 | 4~5 days | 10 days |
| 4 | 5~6 days | 14 days |
| 6 | 6~7days | 14 days |
| 8 | 8~9 days | 18 days |
| 10 | 12~14 days | 18~20 days |
| 12 | 16 days | 22 days |
| 14 | 18 days | 24 days |
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