Main product: Reflow solder, BGA Solder Reflow Oven, SMT reflow solder, reflow oven, SMT reflow oven, SMT machine, SMT furnace, SMT reflow solder oven, SMT equipment, BGA reflow oven, PCB soldering, PCB reflow oven
Lead free solder
Model: ETA A500
Brief: A500 Lead free reflow oven
Heating System
> Eight groups of top and bottom forced hot air convection heating zones.
> Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air convection.
> Independent temperature control in each zone to ensure temperature uniformity within the process tunnel.
> Power consumption savings of 1/3 as compared to other systems.
> Patented motorized blower in each zone is designed to ensure stable air pressure, withstand high process temperature and is disturbance-free.
> Audible and light tower alarm for temperature limits and blower malfunction.
> Fast start-up (within 20 minutes) from room temperature to work temperature due to the high efficiency of the motorized heating plates.
Cooling System
> Two (2) groups of air fans convection cooling zones.
> Mesh belt conveyor system
> Closed-loop computer control of the conveyor provides a precise and repeatable reflow process.
Control System
> PC control system with windows based control software.
>Lenove Computer and Siemens PLC
Additional Features
> Integrated UPS will be automatically activated in case of main power failure and will keep control PC and conveyor running for minimum 5 minutes to send out PCBs inside the oven tunnel.
> Three (3) profiling ports and integrated profiling software are designed for convenient temperature profiling.
> Swing arm control PC station
> Two (2) emergency stop switches
> Two (2) exhaust ports