Semiconductor Laser Scribing Machine

Product Specifications

Prod Model:	YHS-50C/YHS-75C
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Floor Size:	2m*4m
Worktable Size:	350*350mm
Scribing/Cutting Precision:	10um
Max Scribing/Cutting Speed:	120mm/S
Pulse Width:	3-5um
Laser Power:	50W/75W
Laser Wavelength:	1064nm
Scribing /Cutting Line Width:	50um
Power Supply:	380V(110-220V)/ 50-60Hz/3kVA
Pulse Rate:	200h-50kh
Control Mode:	CNC
Cutting Mode:	Laser
Type:	Laser

Product Description

Application:
Use for cutting solar mono crystalline silicon, poly crystalline silicon solar cell, amorphous ribbon silicon and silicon wafers and etc.
Product Features:
Improved & new generation machine. Integration design, no exterior connect
Easy to install and move the machine
High precision water cooling system. Stable and continuous processing
Easy and convenient operation, No to replace the Krypton lamp, maintenance-free.
Diode side-pump laser and high integration, better quality beam & high speed
Acousto-optic modulation; X-Y movable working table; Updated Software
Worktable: Adsorption of double gas warehouse vacuum, double position works T model platform in turn
Cooling way: Integration constant temperature circulation water cooling