Product Specifications
| Prod Model: |
zgnm1145 |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Unit Size .Panle Size: |
15inch 11 |
| Material: |
Paper Phenolic Copper Foil Substrate |
| Type: |
Combining Rigid Circuit Board |
| Dielectric: |
FR-4 |
| Flame Retardant Properties: |
V0 |
Product Description
Layers: 1 to 20 Layers
Base Materials: XPC, FR1, FR2, CEM1, FR4, Matel-base Base Copper Thickness: 17.5 to 70 microns.
BoardThickness: 0.4mm-3.2mm
Maximum Panel Size: 406mm X 610mm
Minimum Hole Diameter: 0.4mm
PTH Hole Tolerance: 0.04mm
Immersion gold thickness: 0.025um -- 0.2um
Electrical Testing: Voltage: 24V - 300V
Ontinuity: 5 - 100 Ohms
Shenzhen Posin Circuit Technology Co., Ltd. was established in April, 2008, After
years'efforts, the company has expanded rapidly and keptIntroducing
new production equipments. We have also trained a professional team
and perfected the quality management system ranging. the
manufacture ability of our company is expanded rapidly. The annual
output of double-sided and multi-layer PCB exceeds 100, 000
square meters.
