Product Specifications
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Material: |
Compound Semiconductor |
| Manufacturing Technology: |
Discrete Device |
| Type: |
Power Mosftes |
Product Description
1: Raw Material: Kovar OHFC, Tungsten Copper, Molybdenum, Al2O3 Ceramic
2: High Reliability, used at high temperature of 450 degree C
3: Manufacturing Standard: China Military Standard GJB923A-2004 (MIL-STD-19500) and Screened per MIL-PRF-38354
Performance and Reliability:
1. Hermeticity: ≤ 1X10-8 ATM(He) CC/Sec
2. Final Finish: Electrolytic Nickel 1.89-8.9μ M Gold: ≥ 1.27μ M
3. LEAD Resistance: ≤ 4mΩ
4. Isolation Resistance: ≥ 109Ω
5. Temp Cycle: -65-+175 degree C 500 times.
6. Thermal Shock: -65~150 degree C 15times
7. Moisture Proof Test: Comply with China Military Standard GJB548A 10 times Cycle
8. Mechanical Environment Test per China Military Standard GJB923A: Mechanical shock: 1500g Sweep vibration: 20g Constant acceleration: 20000g
SStreamtek Electronics was found in 1998 and started the operation in China since 1999, our mission is to be a global supplier and a solution provider of hermetic packages and assemblies with expected high quality at competitive price; Streamtek has two business unit: Glass to metal Seal and Ceramic to metal Seal; And offers wide variety of high reliability hermetic packages that are used in applications of: Military, Aerospace, Aviation, Power electronics, Bio-Medical, Automotive, Telecommunications, MEMS Sensor, Hybrid IC Indutries.
1. Full solution of hermetic packages for Power devices that widely used in Aerospace, Aviation, Power Electronics industries. These packages are manufactured per China Military Standard GJB923A-2004 (MIL-STD-19500) and screened per: MIL-STD-38354. All these packages are sealed with Ceramic eyelet for excellent performance and high reliability, we have full production lines for:
1.1. SMD Package, Such as SMD-0.5, SMD-1, SMD-2, etc
1.2. Ceramic-eyelet To Package: To254, TO257, TO258, TO259, Z shape base is always available; With BeO, Moly, GLIDCOP, W/Cu.
1.3. Ceramic eyelet Hybrid hermetic Package
1.4. Ceramic eyelet Thick film Hybrid hermetic Package
1.5. Ceramic eyelet TO Header
1.6. Ceramic Seal Hermetic Stud Package
1.7. Ceramic-seal Hockey Puk Hermetic Package.
2. Photonics Packages
2.1 Butterfly package with Ceramic Eyelet, HTCC Multiple-layer Ceramic Feedthru, Glass Eyelet, with GPO or Window-lens
2.2. HHL Package with Ceramic Eyelet, Glass Eyelet
2.3. DIL/DIP package with Ceramic Eyelet, Glass Eyelet
2.4. Compact Power package with Ceramic eyelet package
2.5. To header with Ceramic Eyelet, Glass Eyelet
2.6. Package integrate with GPO/Window-lens
2.7. Packages for Modulators
4. Glass to metal Seal Sensor Header
1. Stainless Steel Sensor Header, 13mm, 19mm
2. To5 Header, To8 Header
5. Glass to metal Seal Hybrid IC Package
1. DIL/DIP package
2. Flat-packages
3. Platform packages
