Specifications
Tin Solder Preforms
1. Precisely to increase the volume of solder
2. Low impurities
Introduction
With improvements in the performance and reliability of electronic equipment, the size of components and printed wiring boards are becoming smaller and their density is increasing. Our solder preform is helps cope with such high-density technologies. Poor solder wettability has been a drawback of existing Lead-Free solder. However, since our solder preform contains very little impurities resulting in less oxidation and contamination on the solder surface, it exhibits good solder wettability without flux when hydrogen gas or foaming gas is used.
Advantages
1. Precisely to increase the volume of solder
2. Precisely control the solder volume when used alone
3. Compatible with the standard pickup requirements
4. Compatible with the standard size of the nozzle
5. All standard solder alloys are available
6. Reduce the need for solder paste overprinting, thereby reducing the flux splatter
7. Reduce the ratio of flux in standard solder paste so that cut down the flux residue
Application
This product is applicable to the plug-in parts, components for assembly process. With the advantages of precisely increasing the volume of solder, reducing insufficient solder voids appearance and non-performing rate which are caused by the irregular parts feet, to improve the solder ability.
Type
1. Our solder preform is available in various forms to match any application such as washer, ring, pellet, disk or ribbon.
2. 1206, 0805, 0603, 0603R, 0402 standard rectangle solder preforms are available
3. Pad round, disc-shaped, and the larger rectangle solder preforms are also available
4. Alloy composition: Sn96.5/Ag3.0/Cu0.5, Sn99/Ag0.3/Cu0.7, Sn63Pb3
Model Dimension Volume
a b c
mm inch mm inch mm inch mm³ inch³
0402 1.00 0.039 0.50 0.020 0.50 0.020 0.25 0.000015
0603 1.60 0.063 0.80 0.031 0.80 0.031 1.02 0.000061
0805 2.01 0.079 1.30 0.051 0.76 0.028 1.98 0.000113
1206 3.56 0.140 1.52 0.060 0.77 0.030 4.17 0.000254
0201 0.25 0.010 0.25 0.010 0.5 0.020 0.03 0.000002
Specifications
Where it is a standard rectangle shape: A (length), b (width), c (thickness)
Tolerance of product: ± 0.05 mm (a&b), ± 10% (c)
With improvements in the performance and reliability of electronic equipment, the size of components and printed wiring boards are becoming smaller and their density is increasing. Our solder preform is helps cope with such high-density technologies. Poor solder wettability has been a drawback of existing Lead-Free solder. However, since our solder preform contains very little impurities resulting in less oxidation and contamination on the solder surface, it exhibits good solder wettability without flux when hydrogen gas or foaming gas is used.
Advantages
1. Precisely to increase the volume of solder
2. Precisely control the solder volume when used alone
3. Compatible with the standard pickup requirements
4. Compatible with the standard size of the nozzle
5. All standard solder alloys are available
6. Reduce the need for solder paste overprinting, thereby reducing the flux splatter
7. Reduce the ratio of flux in standard solder paste so that cut down the flux residue
Dongguang SIGway Tin Alloy Co., Ltd. is a wholly owned subsidiary of TOMAS SOLDER SDN BHD in Malaysia. Founded in 1997, the company integrates research and development, production, sale, technical service and training. It is able to build reliable and high-quality tin alloy systems with good economic benefits for customers and provide high-quality products and complete technical service. The company has production bases and laboratories in China and Malaysia. With advanced equipment and a group of senior technical experts in metal, the company has become one of the fast-developing suppliers of welding materials for electronics, industry, medicine and aerospace.
The company produces in strict accordance with ISO9001 Quality Management System. It implements strict monitoring on the production system and the quality system, ensuring the stability and consistency of product quality. SIGMA EB and T product series are accordant with standards such as American QQS-
571R and ANSI/JSTD BELLCORE, Japanese JIS and Chinese GB/T3131
In order to protect the environment and human security, people of the globe are actively developing lead-
Free and halogen-free production technology. Walking at the forefront of the industry, the company produces EB and T lead-free (halogen-free) products in batches, which are widely applied to consumption electronics, industry, medicine, aerospace, etc.
For meeting demands of customers, we will further explore our potential, reduce cost, improve quality, complete related supporting service and push forward development of the electronic industry so as to win approval of customers. We will wholeheartedly provide low-cost and high-quality products and the best satisfactory service for you.
