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| Supplier: | Fulltronics Corporation Ltd. |
|---|---|
| Price: | US $ 10/Piece |
| Min Order: | 5/Piece |
| Quantity:: | |
| Trade Terms: | FOB,CFR,CIF |
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| Prod Model: | OEM |
|---|---|
| Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Board Thickness: | 1.6mm |
| Cooper Weight: | 1oz |
| Solder Mask: | Green |
| Silkscreen: | White |
| Base Material: | FR-4 |
| Mode Of Production: | SMT |
| Metal Coating: | Copper |
| Stencil size/range: | 736x736mm |
| Minimum IC pitch: | 0.30mm |
| Maximum PCB size: | 1200x 500mm |
| Minimum PCB thickness: | 0.35mm |
| Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
| Maximum BGA size: | 74x74mm |
| BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
| BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
| QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
| Frequency of stencil cleaning: | 1 time/5 to 10 pieces |
| Turn Times: | Quick turn are our Specialty |
| Volume: |
One piece to low valume production quantityes Low cost first article builds Schedule deliveries |
| Assembly type: |
Surface mount(SMT) assembly Thru-hole Mixed(surface mount and thu-hole) technology Single or double sided placement Cable assembly |
| Components type: |
Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
| Stencil: | Laser cut stainless steel |
| Parts procurements: |
Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
| Solder type: |
Leaded Lead-free/ROHS compliant |
| Other capabilities: |
Repair/rework services Mechanical assembly Box build/electromechanical assembly Mould and plastic injection. |
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