Product Specifications
Prod Model: |
GC-TP |
Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
Application: |
IC, CPU, Graphics Processing Chip, Power Electro |
Type: |
Insulation Sheet |
Chemistry: |
Hybrid Insulation |
Material: |
Silicone |
Brand: |
Gold-Cool |
Certification: |
RoHS , Reach |
Color: |
Grey Blue |
Product Description
No matter use what kind of cooling device to use, if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components, the cooling device will not be able to effectively reduce the heat of electronic components.
This series of products have very good thermal conductivity and filling properties, its softness, elastic characteristics can fill the gap well between heating component and the heat dissipation module, the gap between the metal body and chassis, fast heat dissipation, to promote the work efficiency of components, to extend the service life of equipment.
Content |
Unit |
550-A05 |
Test standard |
|
|
Color |
_ |
Aqua blue |
_ |
|
Thickness |
mm |
0.5±10% |
ASTM D374 |
|
Release liner |
mm |
0.1PET/0.1PET |
_ |
|
Size |
mm |
200*200 |
_ |
|
Hardness |
Shore 00 |
30±5 o |
ASTM D2240 |
|
Thermal conductivity |
w/m.k |
5.5 |
ASTM D5470 |
|
density |
g/cm 3 |
2.1 |
ASTM D792 |
|
Thermogravimetric loss |
% |
<1.0 |
120°C/24hr |
|
Tensile strength |
g/cm 2 |
490 |
ASTM D412 |
|
Extensibility |
% |
151 |
ASTM D412 |
|
Surface resistance |
Ω |
>1.0*10 13 |
ASTM D257 |
|
Volume resistivity |
Ω.cm |
>1.0*10 13 |
ASTM D257 |
|
Dielectric strength |
kv/mm |
>9 |
ASTM D149 |
|
Use environment |
°C |
-40~200 |
_ |
|
|
|
Dongguan Gold- cool nano technology Co. Ltd is a high-tech enterprise set development, manufacture and sales in a body in the field of thermal conductive and heat dissipation nano products, . Gathered a group of heat conduction, heat dissipation industry professionals, deep cooperation with senior industry experts and research institutes, combined with the demand practical experience of customers and markets for many years. We are committed to provide more personalized, more cost-effective thermal conductivity, heat dissipation one-stop solution to electronic and electric power industry.
Gold-cool currently provides the main thermal conductivity, heat dissipation products such as: AB components encapsulant, one-component thermal conductive silica gel, thermal conductive silicone grease (cream), thermal conductive mud (clay), thermal conductive silica pad, thermal conductive silicon adhesive fabric, thermal conductive silicone cap, double-side thermal conductive adhesive tape, thermal plastic, breathing ceramic heat sink, etc. The thermal conductivity, heat dissipation products are widely used in power supply, LED products, PC, mobile devices, 3Cproducts, photoelectric products, optothermal products and other industries.
Dongguan Gold cool nano technology Co. Ltd. Keeps the tenet of "stability, innovation and sustainability", rigorous pragmatic style of work, pioneering spirit, innovation, stability, excellent quality for the new and old customers with the most efficient, stable and high quality service, win-win development with customers.