High technology 1~16layers PCBs from 0.2~3.2mm thickness with 0.3~4.0oz copper thickness
FR4, FR4(TG130, 150, 170), FR1, CEM-1, CEM3, Aluminum based, HF (Rogers, Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCBs
RoHS/UL, ISO9001: 2008 & ISO/TS16949: 2009, ISO14001: 2004
What will you get from FZ-PCB
Reliable and stable quality with more than 12 years pcb manufacturing experience.
Quick response & 24 hours available service.
Professional sales service & advice.
Fulfillment of our promises, NO lies.
Protecting your Intellectual property. All our staff of trained professionals are working under a strict confidential contract.
Assisting in reviewing design gerber, provide technology support, improve work efficiency.
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Payment method
1. T/T
2. Paypal
3. Western Union
| Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
| Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide. |
| Layer No. | 1 - 16 Layers |
| Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.3OZ - 6OZ |
| Impedance Control | ±10% |
| Warp and Twist | ≤0.075% |
| Peel Strength | ≥61B/in(≥107g/mm) |
| Min Trace Width (a) | 3mil |
| Min Space Width (b) | 3mil |
| Min Annular Ring | 0.004"(0.1mm) |
| SMD Pitch (a) | 0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
| Register tolerance | 0.05mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Solder mask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.008"(0.20mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Max PTH Aspect Ratio | 10:1 |
| Hole Registration | 0.003"(0.075mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
| Beveling | 30°45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
| Certificate | ROHS ISO9001 TS16949 SGS UL |
| Special requirements | Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger |
FZ-PCB is one of Asia' S leading full-service PCB to PCBA solution providers. Established in the year 2002, mainly provide the high-level quality PCB board and PCB assembly service to our customer which are the leading companies in the telecommunication, LED, medical treatment, aviation, instrumentation, micro-electronics and automated-control area. Our achievements are recognized through our customers' Success, industry and customer recognition, and continuous quality improvement.
