Sireda Technology Co, . Ltd >> Emcp/ Nand Flash Test & Burn-in Socket Memory IC Testing Contactor Solutions SD Test Sockets BGA186 (eMCP) Socket SD Solution_12X13.5mm

Emcp/ Nand Flash Test & Burn-in Socket Memory IC Testing Contactor Solutions SD Test Sockets BGA186 (eMCP) Socket SD Solution_12X13.5mm

Emcp/ Nand Flash Test & Burn-in Socket Memory IC Testing Contactor Solutions SD Test Sockets BGA186 (eMCP) Socket SD Solution_12X13.5mm
Price: US $ 345/Piece
Trade Terms: FOB,EXW,others
Min Order: 1/Piece
Pay Type: T/T,Paypal,Western Union
The SD solution is designed for test, debug, validation, and programming of eMMC, eMCP devices
The SD solution provides a compact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development. 
 
Test, debug, validation, and programming of  eMMC, eMCP devices
Failure analysis / System and wafer test
Package and Chip qualification
Production prototype / Data recover
 
Suitable for devices of  Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston etc eMMC and eMCP.
Support eMMC version: ≤eMMC5.0.
Support hot plug, eMMC can be directly connected to PC with SD card reader.
Realize reading, accessing and writting data for eMMC and eMCP devices
 

Mechanical
Socket Body: PPS
Socket Lid: AL
Contact: Spring Probe
Operation Temperature: -40ºC to 140ºC
Life Span at Operating Travel:100K min.
Cycles Spring Force:27g per Pin

Electrical
Current Rating (Continuous) : 2.59A
Self Inductance:1.57nH
Bandwidth -1dB:10GHz
DC Resistance: 42mohm
 


Place a Device by hand on to the socket.
Lock the lid.
Connect to PC by SD Card Reader.
Now it is ready for use.

Prod Model: 702-0000003
Markets: North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Pitch:0.5mm: Pin Count:162 / 186
IC Size:12X13.5mm: Structure:Clamshell
Package:BGA: Contact:Spring Probe
Sireda is a research and develop, production and sales of high-tech Enterprise, the company specialized development of all kinds IC socket, IC test & burn in socket, BGA test fixture that used in the integrated circuit function test, providing one step service of BGA rework: BGA component removal, remove BGA underfill, reballing, IC testing, BGA replacement, specialized in BGA reballing kit and BGA stencil.

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