Product Specifications
| Prod Model: |
702-00000086 |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Pitch:0.5mm: |
Pin Count:162 |
| IC Size:12X16mm: |
Structure:Clamshell |
| Package:BGA: |
Contact:Spring Probe |
Product Description
The SD solution is designed for test, debug, validation, and programming of eMMC, eMCP devices
The SD solution provides a compact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development.
Test, debug, validation, and programming of eMMC, eMCP devices
Failure analysis / System and wafer test
Package and Chip qualification
Production prototype / Data recover
Suitable for devices of Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston etc eMMC and eMCP.
Support eMMC version: ≤eMMC5.0.
Support hot plug, eMMC can be directly connected to PC with SD card reader.
Realize reading, accessing and writting data for eMMC and eMCP devices
Mechanical
Socket Body: PPS
Socket Lid: AL
Contact: Spring Probe
Operation Temperature: -40ºC to 140ºC
Life Span at Operating Travel:100K min.
Cycles Spring Force:27g per Pin |
Electrical
Current Rating (Continuous) : 2.59A
Self Inductance:1.57nH
Bandwidth -1dB:10GHz
DC Resistance: 42mohm
|
Place a Device by hand on to the socket.
Lock the lid.
Connect to PC by SD Card Reader.
Now it is ready for use. |
Sireda is a research and develop, production and sales of high-tech Enterprise, the company specialized development of all kinds IC socket, IC test & burn in socket, BGA test fixture that used in the integrated circuit function test, providing one step service of BGA rework: BGA component removal, remove BGA underfill, reballing, IC testing, BGA replacement, specialized in BGA reballing kit and BGA stencil.
