Categories
Price: | US $ 5/Piece |
---|---|
Trade Terms: | FOB,CFR,CIF |
Min Order: | 5/Piece |
Pay Type: | L/C,T/T,D/P,Paypal,Money Gram |
Stencil size/range: | 736x736mm |
Minimum IC pitch: | 0.30mm |
Maximum PCB size: | 1200x 500mm |
Minimum PCB thickness: | 0.35mm |
Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Maximum BGA size: | 74x74mm |
BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
Frequency of stencil cleaning: | 1 time/5 to 10 pieces |
Turn Times: | Quick turn are our Specialty |
Volume: | One piece to low valume production quantityes Low cost first article builds Schedule deliveries |
Assembly type: | Surface mount(SMT) assembly Thru-hole Mixed(surface mount and thu-hole) technology Single or double sided placement Cable assembly |
Components type: | Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
Stencil: | Laser cut stainless steel |
Parts procurements: | Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
Solder type: | Leaded Lead-free/ROHS compliant |
Other capabilities: | Repair/rework services Mechanical assembly Box build/electromechanical assembly Mould and plastic injection. |
Prod Model: | OEM |
---|---|
Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
Board Thickness: | 1.6mm |
Min Hole: | 0.1mm |
Copper Thickness: | 1oz |
Min. Line Width: | 0.1mm |
Min. Line Spacing: | 0.1mm |
Surface Finishing: | Immersion Gold |
Solder Mask: | Green |
Silk Screen: | White |
Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
Material: | Fiberglass Epoxy |
Flame Retardant Properties: | HB |
Base Material: | Fr4 |