Product Specifications
| Prod Model: |
pcb, pcbs, pcb board, circuit board |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Surface Finish: |
Enig, Immersion Silver, HASL, OSP, Gold Finger |
| Special Process: |
Epoxy Resin, Laser Drill, Blind/Bury Holes |
| Board Thickness: |
0.2~3.2mm |
| Type: |
Rigid Circuit Board |
| Dielectric: |
FR-4 |
| Material: |
Fiberglass Epoxy |
| Flame Retardant Properties: |
V0 |
Product Description
1~16layers PCBs, 0.2~3.2mm thickness, 0.3~4.0oz copper thickness
FR4, FR4(TG130, 150, 170), FR1, CEM-1, CEM3, Aluminum based, HF (Rogers, Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCB
RoHS/UL, ISO9001: 2008 & ISO/TS16949: 2009, TS14001: 2004
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Payment method
1. T/T
2. Paypal
3. Western Union
| Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
| Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide. |
| Layer No. | 1 - 16 Layers |
| Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.3OZ - 6OZ |
| Impedance Control | ±10% |
| Warp and Twist | ≤0.075% |
| Peel Strength | ≥61B/in(≥107g/mm) |
| Min Trace Width (a) | 3mil |
| Min Space Width (b) | 3mil |
| Min Annular Ring | 0.004"(0.1mm) |
| SMD Pitch (a) | 0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
| Register tolerance | 0.05mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Solder mask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.008"(0.20mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Max PTH Aspect Ratio | 10:1 |
| Hole Registration | 0.003"(0.075mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
| Beveling | 30°45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
| Certificate | ROHS ISO9001 TS16949 SGS UL |
| Special requirements | Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger |
FZ-PCB is one of Asia' S leading full-service PCB to PCBA solution providers. Established in the year 2002, mainly provide the high-level quality PCB board and PCB assembly service to our customer which are the leading companies in the telecommunication, LED, medical treatment, aviation, instrumentation, micro-electronics and automated-control area. Our achievements are recognized through our customers' Success, industry and customer recognition, and continuous quality improvement.
