Metal Bonding Epoxy Adhesive (SE2225)
SE2225 is two component adhesive, it can cure in room temperature or by heating. After mixing part A and part B by 1: 1, the adhesive cures in short time and be protection.
Features
1. Resistance of moisture, pollution and other atmospheric constituent
2. High tensile, excellent adhesive property, cracking resistance and ductibility
3. Good anti-pollution, the require of surface pretreatment is low
4. Solvent free, no by-product in curing
5. Good temperature resistance, -50º C~150º C
6. Good bonding with glass fabric and steel metal
Use
Use for bonding metal, SMC FRP, aluminum honeycomb pane and electrical machine shank and Nomex paper. It's proper for VPI craft, glass fiber bonding, automobile parts assembling etc.
Operation
1. Mix Part A and Part B by 1: 1 evenly, seal the parts after using.
2. Stirring by one direction for avoiding the bubbles; The frame and bottom also need to be stirred evenly, or it will cause not cure situation.
3. Low temperature will slow the curing speed, if the primary strength can't get, the application environment needs to do constant temperature control.
4. Taking care of the material mouth seal in using
Package Storage
2*310ml Tube, 2*10kg/bottle Seal and Avoid light and light
Or 2*20kg/drum Temperature≤ 25º C, humidity≤ 50%RH
Shelf life: 6 months
|
Properties before curing |
|
Part |
A |
B |
|
Component |
Beige viscous body |
Beige viscous body |
|
Viscosity, mPa.s(25 ºC ) |
75,000 |
56,000 |
|
Density, g/cm3(25 ºC ) |
1.35 |
1.35 |
|
Mixture/mass ratio, weight |
A:B = 100:100 |
|
Mixture/mass ratio, volume |
A:B = 100:100 |
|
Viscosity after mixing,mPa.s (25 ºC ) |
65,000 |
|
Density after mixing, g/cm 3 ,25 ºC |
1.35 |
|
Operation time after mixing, min(25 ºC ) |
10 |
|
Preliminary curing time(min) |
25 ºC 25 mins or 65 ºC 6 mins |
|
Properties after curing |
|
Hardness, Shore D |
80 |
|
Shear strength, Mpa,Al/Al |
17 |
|
Heat conductivity, W/mK |
0.35 |
|
Expansion parameterμm/(m, ºC ) |
60 |
|
Water absorption 24h,25 ºC ,% |
<0.3 |
|
Dielectric strength, KV/mm |
>15 |
|
Loss factor(1 MHz) |
0.014 |
|
Dielectric constant (1 MHz) |
3.53 |
|
Volume resistance DC500V, Ω@cm |
1.2×10 15 |
Founded in DEC. 2003, SEPUNA has been engaged in researching, manufacturing and marketing automobile sealant and adhesive for 9 years.
Since the foundation, SEPUNA Chemical has been focusing on adhesive's researching and application. Then in 2005, We acquired PUNADE technology which is from Switzerland.
Within 9 years, SEPUNA mainly develops Silicone, Polyurethane and Epoxy resin adhesives. And in the future, we will enlarge our line to Unsaturated, Natural and Acrylic Resin adhesive.
After 9 years' improvement, by the keep researching and innovation, SEPUNA is already a mature adhesive supplier with the core competitiveness.
