Product Specifications
| Prod Model: |
pcb, pcb board, circuit board |
| Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Surface Finish: |
Enig, Immersion Silver, HASL, OSP, Gold Finger |
| Special Process: |
Epoxy Resin, Laser Drill, Blind/Bury Holes |
| Board Thickness: |
0.2~3.2mm |
| Type: |
Rigid Circuit Board |
| Dielectric: |
FR-4 |
| Material: |
Fiberglass Epoxy |
| Flame Retardant Properties: |
V0 |
Product Description
High technology 1~16layers PCBs from 0.2~3.2mm thickness with 0.3~4.0oz copper thickness
FR4, FR4(TG130, 150, 170), FR1, CEM-1, CEM3, Aluminum based, HF (Rogers, Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCBs
RoHS/UL, ISO9001: 2008 & ISO/TS16949: 2009
Our PCB board manufacture
* PCB board file with parts list provided by customers
* PCB board made, circuit board parts purchased by us
* PCB board with parts assembled
* Electronic testing circuit board or PCBA
* Fast delivery, anti-static package
* RoHS Directive-compliant, lead-free
Delivery Time for PCB board
1) PCB production time: Sample: 4 days / mass production: Within 8 days
2) Component purchase: 2 days if all components is available in our domestic market.
3) PCB Assembly: Samples: Whthin 4 days / mass production: Within 8 days
Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
*AOI (Automated Optical Inspection)
Detailed Terms for PCB Manufacturing
---Technical requirement for pcb assembly:
* Professional Surface-mounting and Through-hole soldering Technology
* Various sizes like 1206, 0805, 0603 components SMT technology
* ICT(In Circuit Test), FCT(Functional Circuit Test) technology.
* PCB Assembly With UL, CE, FCC, Rohs Approval
* Nitrogen gas reflow soldering technology for SMT.
* High Standard SMT&Solder Assembly Line
* High density interconnected board placement technology capacity.
Quotation Requirement and Time:
1) Following specifications are needed for quotation:
A) Base material:
B) Board thickness:
C) Copper thickness:
D) Surface treatment:
E) color of solder mask and silkscreen:
F) Quantity
2) Qutoation within 2 hour after we get the gerber file or pcb file with complete specifications
Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.
3. By EMS (Usually for Russia Clients), price is high.
4. By sea for mass quantity according to customer's requirement.
5. By customer's Forwarder
6. By Paypal, T/T, West Union, etc.
| Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
| Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide. |
| Layer No. | 1 - 32 Layers |
| Board thickness | 0.0075"(0.2mm)-0.200"(5.0mm) |
| Board Thickness Tolerance | ±10% |
| Copper thickness | 0.3OZ - 6OZ |
| Impedance Control | ±5% |
| Warp and Twist | ≤0.075% |
| Peel Strength | ≥61B/in(≥107g/mm) |
| Min Trace Width (a) | 3mil |
| Min Space Width (b) | 3mil |
| Min Annular Ring | 0.004"(0.1mm) |
| SMD Pitch (a) | 0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
| Register tolerance | 0.05mm |
| Min Solder Mask Dam (a) | 0.005"(0.125mm) |
| Solder mask Clearance (b) | 0.005"(0.125mm) |
| Min SMT Pad spacing (c) | 0.004"(0.1mm) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Hole size | 0.008"(0.20mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
| Max PTH Aspect Ratio | 10:1 |
| Hole Registration | 0.003"(0.075mm) |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-3u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
| Beveling | 30°45° |
| V-cut | 15° 30° 45° 60° |
| Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
| Certificate | ROHS ISO9001 TS16949 SGS UL |
| Special requirements | Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger |
FZ-PCB is one of Asia' S leading full-service PCB to PCBA solution providers. Established in the year 2002, mainly provide the high-level quality PCB board and PCB assembly service to our customer which are the leading companies in the telecommunication, LED, medical treatment, aviation, instrumentation, micro-electronics and automated-control area. Our achievements are recognized through our customers' Success, industry and customer recognition, and continuous quality improvement.
