Categories
| Supplier: | Fulltronics Corporation Ltd. |
|---|---|
| Price: | US $ 6/Piece |
| Min Order: | 5/Piece |
| Quantity:: | |
| Trade Terms: | FOB |
|
|
| Prod Model: | OEM |
|---|---|
| Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Base Material: | Fr4 |
| Copper Thickness: | 1oz |
| Board Thickness: | 1.6mm |
| Min. Hole Size: | 0.1mm |
| Min. Line Width: | 0.1mm |
| Surface Finishing: | Immersion Gold |
| Production Process: | Semi-Additive Process |
| Material: | Epoxy Paper Laminate |
| Structure: | High Frequency PCB |
|
Stencil size/range: |
736x736mm |
|
Minimum IC pitch: |
0.30mm |
|
Maximum PCB size: |
1200x 500mm |
|
Minimum PCB thickness: |
0.35mm |
|
Minimum chip size: |
0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
|
Maximum BGA size: |
74x74mm |
|
BGA ball pitch: |
1.00mm (minimum), 3.00mm (maximum) |
|
BGA ball diameter: |
0.40mm (minimum), 1.00mm (maximum) |
|
QFP lead pitch: |
0.38mm (minimum), 2.54mm (maximum) |
|
Frequency of stencil cleaning: |
1 time/5 to 10 pieces |
|
Turn Times: |
Quick turn are our Specialty |
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Volume: |
One piece to low valume production quantityes Low cost first article builds Schedule deliveries |
|
Assembly type: |
Surface mount(SMT) assembly Thru-hole Mixed(surface mount and thu-hole) technology Single or double sided placement Cable assembly |
|
Components type: |
Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
|
Stencil: |
Laser cut stainless steel |
|
Parts procurements: |
Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
|
Solder type: |
Leaded Lead-free/ROHS compliant |
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Other capabilities: |
Repair/rework services Mechanical assembly Box build/electromechanical assembly Mould and plastic injection. |
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