Product Specifications
Prod Model: |
OEM |
Markets: |
North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
Base Material: |
Fr4 |
Copper Thickness: |
1oz |
Board Thickness: |
1.6mm |
Min. Hole Size: |
0.1mm |
Min. Line Width: |
0.1mm |
Surface Finishing: |
Immersion Gold |
Production Process: |
Semi-Additive Process |
Material: |
Epoxy Paper Laminate |
Structure: |
High Frequency PCB |
Product Description
OEM/ODM/EMS Services for PCBA:
PCBA, PCB Board assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting
Capability - SMT
Lines 9(5 Yamaha, 4KME)
Capacity 52 million placements per month
Max Board Size 457*356mm. (18"X14")
Min Component size 0201-54 sq. Mm. (0.084 sq. Inch), long connector, CSP, BGA, QFP
Speed 0.15 sec/chip, 0.7 sec/QFP
Capability - PTH
Lines 2
Max board width 400 mm
Type Dual wave
Pbs status Lead-free line support
Max temp 399 degree C
Spray flux add-on
Pre-heat 3
If you need to get a formal quotation, please provide the spec as below:
1. PCB files in gerber file, . Pcb or. Pcbdoc formart
Please feel free to contact Fulltronics team. We are here ready to assist you with our professional skills and cheerful services
Stencil size/range: |
736x736mm |
Minimum IC pitch: |
0.30mm |
Maximum PCB size: |
1200x 500mm |
Minimum PCB thickness: |
0.35mm |
Minimum chip size: |
0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Maximum BGA size: |
74x74mm |
BGA ball pitch: |
1.00mm (minimum), 3.00mm (maximum) |
BGA ball diameter: |
0.40mm (minimum), 1.00mm (maximum) |
QFP lead pitch: |
0.38mm (minimum), 2.54mm (maximum) |
Frequency of stencil cleaning: |
1 time/5 to 10 pieces |
Turn Times: |
Quick turn are our Specialty |
Volume: |
One piece to low valume production quantityes
Low cost first article builds
Schedule deliveries |
Assembly type: |
Surface mount(SMT) assembly
Thru-hole
Mixed(surface mount and thu-hole) technology
Single or double sided placement
Cable assembly |
Components type: |
Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch
|
Stencil: |
Laser cut stainless steel |
Parts procurements: |
Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest |
Solder type: |
Leaded
Lead-free/ROHS compliant |
Other capabilities: |
Repair/rework services
Mechanical assembly
Box build/electromechanical assembly
Mould and plastic injection.
|
Fulltronics Corporation Ltd is a manufacturer and exporter specializing in Printed Circuit Board fabrication, Assembly and development from the start of 2002
In the early years our core business consist of fabrication of prototypes pcbs, High frequency pcbs, multilayer pcbs, flex pcbs and rigid-flex pcbs for companies of home and abroad. All PCBs are manufactured with advanced quality control systems and are recognized by ISO-9001 and TS16949, UL Certification and ROSH. In 2006 Fulltronics set up an assembly house enabling us to offer a fully integrated array of services, including SMT Assembly, T/H Through Hole Assembly, wire Assembly, Box-build&assembly and functional testing to ensure the highest level of quality control. You can choose any of the procedure you need.
Today our products are applied for medical, defence, broadcasting, telecommunication systems, Industrial control, traffic intelligence systems, auto industry, agriculture and so on. We manufactured products keeping high pace with newly technology developments. Fulltronics Corporation combines fashion and application well to satisfy diverse of customers requirments.
For the most, we take pride in providing excellent quality Products at very competitive prices, outstanding service and timely delivery. If you have any PCB or PCB Assembly projects, just give us opportunities, we perfect your ideas.