Categories
Price: | US $ 100-135/Square Meter |
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Trade Terms: | FOB,FCA,EXW |
Min Order: | 1/Piece |
Pay Type: | T/T |
Factory Manufacture Capability | ||
NO | ITEM | Techinical capabilities |
1 | Materials | CEM-1 CEM-3 FR-4 High-TG Teflon Rogers etc. |
2 | layers | 1-16 layers |
3 |
Min.core material |
5mil(excluding copper) |
4 | Prepreg type | 7628 2116 1080 3313 |
5 | Max.board size | 520*720mm |
6 | Copper thickness | min.base copper 1/3 OZ |
max.finished copper6OZ | ||
7 | Min.board thickness | 2- layer 10mil |
4- layer 16mil | ||
6-layer 24mil | ||
8-layer 32mil | ||
10-layer 40mil | ||
8 | Max.board thickness | 236mil(finished board thickness) |
9 | Min.line width/space | 3mil/3mil HOZ copper base(inner layer) |
10 | Min.hole size | 8mil |
11 | PTH wall thickness | ≥1mil |
12 | Hole dia.tolerance | ±3mil |
13 | Hole dia.tolerance | ±2mil |
14 | Countersink hole | Min.depth(D)6mil;The Depth of tolerance±6mil |
15 | Drilling hole positional deviation(outer layer) | 1st-drill ±3mil(Normal) ±2mil(min.) |
2nd-drill ±4mil | ||
16 | Min.solder mask bridge | 3.2mil(HOZ base copper, green) |
17 | Outline tolerance | ±4mil |
18 | Twist & Bow | ≤0.75% |
19 | Peelable mask thickness | ≥8mil 1 printing |
20 | Insulation Resistance | >10MΩ Normal |
21 |
Through hole resistance |
≤100Ω Normal |
22 | Current breakdown | 10A |
23 | Peel strength | 1.4N/mm |
24 | S/M abrasion | >5H |
25 | Thermal stress | 28 degrees 20Sec 3Times |
26 | Test Voltage | 20-300V |
27 | Min.blind/burried via | 8mil |
28 | Surface finish | HAL ENIG IMAG IMSN OSP HAL+G/F ENIG+G/F |
29 | Impedance control | Single ended impedance 50Ω/70Ω±10% Normal |
Differential impedance 90Ω/100Ω±10% Normal | ||
30 | Max.aspect ratio | 12:1 |
Prod Model: | XML131114K02 |
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Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
Application Field: | Consumer Product |
Type: | Rigid Circuit Board |
Dielectric: | FR-4 |
Material: | Fiberglass Epoxy |
Flame Retardant Properties: | V0 |