Product Specifications
| Markets: |
North America,Southeast Asia,Mid East,Western Europe |
| Diameter: |
0.25mm |
| Usage: |
Optical Glass Cutting |
| Kind: |
Plat Sawing Machine |
| Manufacturing Arts: |
Electroplating |
Product Description
Our products have complete range of articles from0.12mm to 0.37mm which are applied in silicon and sapphire cutting serving for semiconductor, PV and LED industry.
Sapphire wafering-wire diameter
Diameter=0.25mm
Key benefits
Reduced cost of ownership
1. Increased capacity without increasing capital expenditures;
2. Faster ROI due to reduced initial capital investment;
3. Lower cost/wafer resulting from reduced TCO;
Quality results
4. Improved TTV;
5. Reduced bow and warp;
6. Holistic approach to cutting;
7. Enhanced RA surface finish reduces secondary processes;
8. Excellent cutting accuracy;
Changsha DIAT New Material Sci. & Tech. Co., Ltd. is a high-tech enterprise specializing in development, manufacture and sale diamond wire for many kinds of the hard crisp materials cutting, such as saphire cutting, silicone for filament cutting, Si ingot squaring, Multi-si brick cropping, etc. Diat's leading products own exclusive intellectual property and invention patent. Supported by the national innovation fund DIAT has developed as one of the most welcome trademark in the field of solar energy, semiconductor and LED industries.
