Changsha DIAT New Material Sci. & Tech. Co., Ltd. >> Fast-Diamond-Coated Wire for Silicon Bricking or Silicon Squaring

Fast-Diamond-Coated Wire for Silicon Bricking or Silicon Squaring

Fast-Diamond-Coated Wire for Silicon Bricking or Silicon Squaring
Supplier: Changsha DIAT New Material Sci. & Tech. Co., Ltd.
Price: Negotiable/Meter
Min Order: 10000/Meter
Quantity::
Trade Terms: FOB
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Product Specifications

Markets: Eastern Asia
Usage: Semiconductor Cutting
Kind: Plat Sawing Machine
Manufacturing Arts: Electroplating

Product Description

Electroplated Diamond Wire is a composited product by a special technology, to electroplate a layer of diamond abrasive particles on high strength steel wire. It is considered as a most prospective high technology product to achieve high efficiency precise cutting for hard and brittle materials such as silicon, sapphire, SiC, Ge, GaAs, glass, ceramics, crystal, YAG, magnetic materials, W alloy.

Compared with steel wire and band saw cutting, the electroplated diamond wire cutting have many advantages: 1) Faster cutting than steel wire; 2) Economical production: No slurry, only city water or water-based coolant; Diamond wire cut repeatedly; 3) High production capacity; 4) Minimum kerfloss; 5) Lower roughness; 6) Better wafer quality.
Changsha DIAT New Material Sci. & Tech. Co., Ltd. is a high-tech enterprise specializing in development, manufacture and sale diamond wire for many kinds of the hard crisp materials cutting, such as saphire cutting, silicone for filament cutting, Si ingot squaring, Multi-si brick cropping, etc. Diat's leading products own exclusive intellectual property and invention patent. Supported by the national innovation fund DIAT has developed as one of the most welcome trademark in the field of solar energy, semiconductor and LED industries.

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