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| Supplier: | Shunde Hophenc Electronic Co., Ltd. |
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| Price: | US $ 1.1-1.3/Piece |
| Min Order: | 50/Piece |
| Quantity:: | |
| Trade Terms: | FOB,CFR,CIF |
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| Prod Model: | B001 |
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| Markets: | North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe |
| Price: | Competitive Price |
| Quality: | High Quality |
| Delivery: | 5-7 Days After Placing an Order |
| Capacity: | 20000 Square Per Month |
| Thickness: | 0.4mm,0.6-0.8mm ,1.0mm ,1.2mm |
| Length: | 0.3-1.2m ,1.5m |
| Thermal Conductivity: | 0.8-1.0 |
| Surface Technique: | OSP ,Rosin/OSP ,Lead HASL , Lead Free HASL |
| Type: | Rigid Circuit Board |
| Application: | Small Household Appliances |
| Base Material: | Fiberglass |
| Dielectric: | Resin |
| Material: | Fiberglass |
| Flame Retardant Properties: | 94 V0 |
| Brand: | Hophenc |
| Items | Specifications |
| Material | aluminum base, copper base, FR-4, CEM-1 |
| Finish Board Thickness | 0.2mm-5.0 mm (8mil-197mil) |
| Board thickness tolerance | ±0.1mm |
| Copper Thickness | H/0 oz, 1/0 oz, 2/0 oz, 3/0 oz; H/H oz, 1/1 oz, 2/2 oz, 3/3 oz |
| Numbr of Layer | single-side LED PCB, double sides LED PCB |
| Max finished Size | 2000mm*450mm |
| Surface Finish | HASL(free lead), ENIG(Electroless nickel immersion gold), immersion silver, OSP |
| Thermal conductivity | 0.6 0.8 1.0 2.0 3.0 4.0 5.0 |
| Min line width | 0.2mm(8mil) |
| Min line spacing | 0.2mm(8mil) |
| Min hole diameter | 0.2mm |
| Min pad size | 1.2mm |
| Insulating layer thickness | 50 75 100 125 150 (μm) |
| Solder Mask Color | White/Green/Black/Matte Black/Red/Golden Yellow |
| Letter Color | White/Black/Green |
| Hole position tolerance | ±0.05mm |
| Metallic hole diameter tolerance | ±0.076mm |
| Twist and bend | ≤0.7% |
| Outline Tolerance | ±0.1mm/4mil (CNC routing); ±0.15mm/6mil (tooling punching) |
| Shaping | V-cut, tooling punching, CNC routing, |
| Solder strength | >6H |
| Thermal Shock | 280°C 10Second 3times |
| Flame retardant | 94V-0 |
| Testing | 100% computer open/short circuit test, Impedance test, Thermal shock Test, Solderability Test, metallographic microsection analysis |
| File format | gerber, protel, power PCB, PADS2007, PCB doc, Auto CAD, sample |
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