Shanghai Sepuna Chemical Technology Co., Ltd. >> Heat-Resistance Conductive Epoxy Potting Adhesives for Electronics

Heat-Resistance Conductive Epoxy Potting Adhesives for Electronics

Name: Heat-Resistance Conductive Epoxy Potting Adhesives for Electronics
Brand: China-Manufacturer-Directory.com
SKU: 730746545
Availability: InStock
Rating: 4.3 (37 reviews)

Supplier:	Shanghai Sepuna Chemical Technology Co., Ltd.
Price:	US $ 3.25-3.85/Piece
Min Order:	2000/Piece
Quantity::
Trade Terms:	FOB,CFR,CIF

Product Specifications

Prod Model:	E4209
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia
Brand Name:	Punade
Model Number:	E4209
Propetry:	Waterproof, Moisture/Temperature Resistance
Certificate:	CE, SGS, ISO9001:2000, MSDS, UL, RoHS
MOQ:	2000 PCS
Samples:	Free Sample
Delivery Time:	Fastest Delivery(5-7days)
Shipping:	by Express(FedEx, UPS, DHL, TNT), or by Sea
Manufacturer:	R&D Manufacturer, Factory, China Supplier
Clients:	Lonking, Jabil, Dongfeng Group, Cummins, Volvo
Classification:	Room Curing
Application:	Electronic
Material:	Epoxy
Characteristic:	Waterproof
Morphology:	Solvent-Free
Color:	Little Yellow/Brown

Product Description

Heat-resistance Epoxy potting adhesives and sealants/conductive epoxy adhesive

E4209A/B is two-component excellent adhesion and Heat-resistance Solvent-free Room Temperature Curable Epoxy Potting Sealant.
Features
1. Good toughness, high hardness
2. Excellent adhesion, resistance to cracking
3. Excellent electrical insulation properties, stability
4. High thermal conductivity, low thermal expansion coefficient
5. Higher Tg, can be used in the -60 ° C -200° C long-term
6. Good waterproof, moisture resistance, low water absorption

Use
It is suitable for high thermal conductivity packaging protection product requirements in automotive electronics.

Operation
1. Mixing: Stirring A component evenly in the original package, then A, B components according to the weight ratio of 4: 1 are weighed and mixed.
2. Using it after stirring evenly and vacuum defoamation, finished within 60 mins.
3. If necessary, the device with good sealing can continue to vacuumize, is helpful to increase the electrical properties of the device.
4. The curing conditions: 80 ° C/2hrs or 25 ° C/24hrs.
5. For the use of glue equipment please consult our marketing department.

Package & Storage
Package Storage
A component: 4kg/ bucket (plastic bucket) Seal and Avoid light and light
B component: 1kg/ bottle Temperature≤ 25° C, humidity≤ 50%RH
Shelf life: Part A 12months, Part B 6 months

Properties before curing
	E4209A	E4209B
Appearance	Little yellow liquid	Brown liquid
Viscosity, mPa.s(25° C)	10,000-15,000	50-100
Density, g/cm3(25° C)	1.10±0.05	1.05±0.05
Mixture/mass ratio, weight	100 : 25
Viscosity after mixing, mPa.s (25° C)	4000±500
Operation time 25° C,hr	1
Gel time 25° C,hr	5
Properties after curing
Hardness, Shore D	≥90
Thermal conductivity, W/mK	0.27
Expansion coefficient, μm/(m,° C)	210
Glass transition temperature , ° C	155
Tensile-shear strength Mpa, Fe / Fe	≥10
Dielectric strength, KV/mm,25° C	≥20
Loss factor(1 MHz)(25° C)	0.09
Dielectric constant (1 MHz)(25° C)	2.9
Volume resistance DC500V, Ω@cm	1.2×1015	2.00E +15

Founded in DEC. 2003, SEPUNA has been engaged in researching, manufacturing and marketing automobile sealant and adhesive for 9 years.

Since the foundation, SEPUNA Chemical has been focusing on adhesive's researching and application. Then in 2005, We acquired PUNADE technology which is from Switzerland.

Within 9 years, SEPUNA mainly develops Silicone, Polyurethane and Epoxy resin adhesives. And in the future, we will enlarge our line to Unsaturated, Natural and Acrylic Resin adhesive.

After 9 years' improvement, by the keep researching and innovation, SEPUNA is already a mature adhesive supplier with the core competitiveness.

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