Xiamen Bolion Circuit Co., Ltd. >> High Quality 6 Layers Multilayer FPC

High Quality 6 Layers Multilayer FPC

Name: High Quality 6 Layers Multilayer FPC
Brand: china-manufacturer-directory.com
SKU: 724731565
Availability: InStock
Rating: 4.6 (137 reviews)

Supplier:	Xiamen Bolion Circuit Co., Ltd.
Price:	US $ 9-10/Piece
Min Order:	1piece
Quantity::
Trade Terms:	FOB,CFR,CIF

Product Specifications

Prod Model:	M7453
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Dimensions:	110 X 32mm
Surface Treatment:	Enig
Line Width/Space:	0.15mm/0.15mm
Au:	0.03 to 0.09um
Ni:	2 to 6um
Outline Tolerance:	±0.2mm
Cover Layer Tolerance:	±0.2mm
Minimum Hole Size:	0.2mm
Minimum Pitch:	0.15mm
Material:	Polyimide
Structure:	Multilayer FPC
Application:	Digital Products
Combination Mode:	Adhesive Flexible Plate
Conductive Adhesive:	Conductive Silver Paste

Product Description

Advantage:

1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc

Xiamen BOLION Workshop Capability
Material Cutting
Content	Normal	Special
Max dimension of material cutting	250MM× 450MM	250MM× 10000MM
Min dimension of material cutting	250MM× 100MM
Auto-machine cutting tolerance	± 1MM
Manually cutting tolerance	± 2MM
Mechanical Drilling
Content	Normal	Special
Min drill Dia.	Dia. 0.20MM	Dia. 0.15MM
Max drill Dia.	Dia. 6.35MM
Min drill space	0.15MM	0.125MM
Drill hole Dia. tolerance	± 0.05 MM
Laser Drilling
Content	Normal	Special
Min drill Dia.	Dia. 0.15MM	Dia. 0.1MM
Max drill Dia.	Dia. 6.35MM
Min drill space	0.1MM
Drill hole Dia. tolerance	± 0.02 MM
Copper plating
Content	Normal	Special
Copper plating capacity(thickness of hole plating)	8-15um; 20-30 um (± 5um' s distribution)	30-70 um
Max PNL dimension for PTH	250MM× 350MM	250MM× 2000MM
Aspect ratio (= board thickness / min via diameter)	2 max for 0.10 mm vias	3 max for 0.10 mm vias
	4 max for 0.15 mm vias	5 max for 0.15 mm vias
	6 max for 0.20 mm vias	7 max for 0.20 mm vias
	8 max for 0.25 mm vias	9 max for 0.25 mm vias
Blue photosensitive etching-resist ink (Silkscreen)
Content	Normal	Special
Max PNL dimension of screen printer	300× 450MM	250MM× 2000MM
Thickness of photo image ink	15-20um	10-40um
Dry film
Content	Normal	Special
Max production dimension of dry film	250MM× 350MM	330MM× ∞ MM
Thickness of dry film	30um	20um; 40um; 50um
Exposure
Content	Normal	Special
Space between pads and line (panel plating)	≥ 0.15MM	≥ 0.10MM
Space between pads and line (via pads pattern plating)	≥ 0.30MM	≥ 0.20MM
Layer to layer misregistration tollerance	0.2MM	0.10MM
Min size of square solder mask opening	0.40MM× 0.40MM
Min circular solder mask open size	Dia. 0.35MM
Min width of solder mask	0.15MM	0.10MM
Solder mask bridge aspect ratio (=length/width)	10 max for 0.10 mm width	15 max for 0.10 mm width
	15 max for 0.15 mm width	20 max for 0.15 mm width
	20 max for 0.20 mm width	25 max for 0.20 mm width
Space between solder mask open and trace	0.1mm	0.05mm
Max PNL size on exposure machine	250MM× 350MM	600MM× 750MM; 600MM× 10000MM (Space > 0.3MM)
Min dimension of non-PTH circular pad	Dia. 0.3MM	Dia. 0.2MM
Min anular ring width of PTH pad	0.125MM	0.10MM
Etching
Content	Common	Special
Max production size of etching	250MM× 350MM	500MM× ∞
Min trace & space width	0.06± 0.01 MM (copper thickness: 12 um)	0.05± 0.01 MM (copper thickness: 12 um)
	0.075± 0.015 MM (copper thickness: 18 um)	0.065± 0.015 MM (copper thickness: 18 um)
	0.1± 0.02 MM (copper thickness: 25~35 um)	0.085± 0.02 MM (copper thickness: 25~35 um)
	0.1± 0.03 MM (copper thickness: 35~45 um)	0.085± 0.02 MM (copper thickness: 25~35 um)
Coverlay alignment
Content	Normal	Special
Coverlay alignment tolerance	± 0.30 MM (manually operating)	± 0.20 MM
Coverlay alignment tolerance	± 0.20 MM (fixturally operating)	± 0.0.15 MM
Min space between opening and pad	0.2MM	0.15MM
Overlap of coverlay opening and iland finger or pads	0.5 MM	0.3 MM for Circular pads
Lamination
Content	Normal	Special
PNL size on quick press	250MM× 400 MM	340MM× 5000MM
PNL size on traditional vacuum press	630× 550MM
Adhesive squeeze when laminating	Quick press: 6± 2mil
Adhesive squeeze when laminating	Vacuum press: 3± 1mil
Silkscreen
Content	Normal	Special
Legend ink color	white, black	Per request
solder mask color	Yellow, green, amber	Per request
silver/carbon pastes color	silver pastes: silver; carbon pastes: black
Working size of silkscreen table	350 MM× 700 MM	250MM× 2000MM
Min character width	0.125 MM	0.10 MM
Min character height	0.80 MM	0.70 MM
Space between character and pad opening	0.5 MM	0.3 MM
Silkscreen alignment tolerance	± 0.30MM	± 0.20 MM
Silkscreen silver pastes tolerance	± 0.50MM	± 0.40 MM
Silkscreen solder mask tolerance	± 0.50MM	± 0.30 MM
Min distance between silkscreen to outline	0.3 MM
Min distance between silkscreen to NPTH	0.3 MM
Printed ink thickness	Legend character: 8-15 um
	Solder mask: 15-25 um
	Silver ink: 10~25 um
	Carbon ink: 10-20um
	Carbon ink: 10-20um
Final finshing
Content	Normal coating thickness	Normal PNL size
Plating nickel gold (In house)	Ni: 2-9um; Au: 0.03-0.09um	300mm× 400 MM
Plating hard gold (In house)	Ni: 2-9um; Au: 0.1-1.0um	300mm× 400 MM
Plating soft gold (In house)	Ni: 2-9um; Au: 0.03-0.09um	300mm× 400 MM
Plating pure tin (In house)	2.0-8.0um	300mm× 400 MM
Immersion Tin (In house)	0.3-0.6um	300mm× 400 MM
OSP (In house)	N/A	300mm× 400 MM
ENIG (Hard Nickel) (In house)	Ni: 2-6um; Au: 0.03-0.10um	300mm× 400 MM
ENIG (Soft Nickel) (In house)	Ni: 2-6um; Au: 0.03-0.10um	300mm× 400 MM
ENEPIG (Hard Nickel) (In house)	Ni: 2-6um; Au: 0.03-0.10um	300mm× 400 MM
HASL (Outsource)	Cover the pads with min thickness 1~2 um	300mm× 400 MM
Immersion silver (Outsource)	Per standand creteria	300mm× 400 MM
Electrical test (Flying probe tester for sample)
Content	Normal	Special
Max test points qty	4096
Min probe	0.25MM	0.15MM
Max probe	1.70MM
Safe distance between test probes	0.20MM
Stiffener, PSA alignment tolerance
Content	Normal	Special
Min safe space between alignments and pads opening	± 0.50 MM	± 0.30 MM
Tolerance without hole-centered alignments	± 0.40 MM	± 0.40 MM
Tolerance with hole-centered alignments	± 0.2 MM
Min strip width of PSA	2MM	1.0 MM
Min seperate PSA size	13× 2.0 MM
Die cutting
Content	Normal	Special
Outline manually cutting (Outline length≤ 100MM)	± 0.20 MM (Need manually cut guide line)
Outline manually cut (Outline length > 100MM)	± 2 ‰
Outline soft tooling cut (Outline length≤ 100MM)	± 0.20 MM
Outline soft tooling cut (Outline length > 100MM)	± 2‰
Outline etching die cut (Outline length≤ 100MM)	± 0.10 MM
Outline etching die cut (Outline length > 100MM)	± 1.5‰
Outline normal hard tooling cut (L< 100MM)	± 0.10 MM
Outline normal hard tooling cut (100≤ L< 150MM)	± 0.15 MM
Outline normal hard toolingcut (L≥ 150MM)	± 1.5‰	± 1.3‰
Outline precise hard tooling cut (L< 100MM)	± 0.05 MM
Outline precise hard tooling cut (100≤ L< 150MM)	± 0.1 MM
Outline precise hard toolingcut (L≥ 150MM)	± 1.2‰	± 1.0‰
Outline segmented cut	± 1.5‰ (soft tooling)
Min punching hole Dia. and tolerance	Dia. 0.60 ± 0.05 MM
Tolerance for hole to board edge	1.0 MM(normal soft die cut tooling)	0.50 MM(Etching die cut tooling, normal hard tooling)
Tolerance for trace center to board edge	0.10 MM	0.08 MM(precise hard tooling)
Package
Content	Normal	Special
Tray	Per product size
Low viscosity PET layer	300× 210MM
Ziplock bag	Per product size
Vacuum sealing package	16cmx23cm, 20cmx34cm,	28cmx36cm, 30cmx50cm

XiaMen Bolion Circuit Co., Ltd. Was established in January 23, 2003. The enterprise includes 24, 000 square meters of clean production workshop containing advanced equipment and sophisticated FPC testing instruments, allowing mass single panel / double panel / hollow board / plywood / layered board / rigid-flex board capabilities. March production of FPC and rigid-flex boards and other high-quality products is a minimum of 16, 000 square meters. Our products are widely used in aerospace, automotive, medical, communication, camera, optical instrument, computer peripheral, and LCD applications, among others.

Our company is a standing member on the China Printed Circuit Board Industry Association (CPCA) and has won various awards including being included on the China Printed Circuit industry list of top 100 Businesses and winning the China India Control Circuit Industry Award as a "National Branded Enterprise". We have passed ISO9001 Quality Management Ceritication, TS16949 Automotive Supply Chain Management Certification, and ISO14001 Environmental Management Certification.

Our FPC product safety test center is approved by the U. S. UL certification, and SGS certified to comply with RoHS & WEEE environmental protection requirements. Ourcompany has accumulated a wealth of experience in the FPC industry, and, through our exceptional product quality control and customer service, we have earned anoutstanding reputation.

At Bolion Circuit Co., Ltd., we advocate a core philosophy of "integrity, innovation, harmony and win-win business relationships" within every aspect of our business. With superb technology, advanced equipment, strict quality control and scientific management, reasonable pricing, and honest business practices, we are dedicated to providing customers with quality products and efficient services.

Through our commitment today to integrity, innovation, harmony, and win-win business relationships, and by providing the most value and quality, we can be proud to present our products to the world and assure our ascent to the top of the FPC industry in the future.